EP 2130419 A1 20091209 - METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT AND CONTACTING ELEMENT WITH AN ELECTRICAL COMPONENT
Title (en)
METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT AND CONTACTING ELEMENT WITH AN ELECTRICAL COMPONENT
Title (de)
VERFAHREN ZUM BESTÜCKEN EINES KONTAKTIERUNGSELEMENTES MIT EINEM ELEKTRISCHEN BAUELEMENT SOWIE EIN KONTAKTIERUNGSELEMENT MIT EINEM ELEKTRISCHEN BAUELEMENT
Title (fr)
PROCÉDÉ D'ÉQUIPEMENT D'UN ÉLÉMENT DE MISE EN CONTACT AVEC UN COMPOSANT ÉLECTRIQUE ET ÉLÉMENT DE MISE EN CONTACT COMPORTANT UN COMPOSANT ÉLECTRIQUE
Publication
Application
Priority
- EP 2008050937 W 20080128
- DE 102007014337 A 20070326
Abstract (en)
[origin: WO2008116677A1] The invention relates to a method for equipping a contacting element (1), in particular a punched grid with an SMD component (4), comprising the following steps: providing the contacting element (1) with a casing, a connector point (3) being provided in a recess (7) of the casing (5); placing the SMD component (4) on the connector point (3); and heating a thermally conductive element in order to heat the connector point (3) so that the SMD component (4) can be connected to the connector point (4).
IPC 8 full level
H05K 3/34 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
H05K 3/3494 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 1/184 (2013.01 - EP US); H05K 3/202 (2013.01 - EP US); H05K 3/3442 (2013.01 - EP US); H05K 2201/0382 (2013.01 - EP US); H05K 2201/0397 (2013.01 - EP US); H05K 2201/09118 (2013.01 - EP US); H05K 2203/0776 (2013.01 - EP US); H05K 2203/081 (2013.01 - EP US); H05K 2203/101 (2013.01 - EP US); H05K 2203/107 (2013.01 - EP US); Y10T 29/49144 (2015.01 - EP US)
Citation (search report)
See references of WO 2008116677A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102007014337 A1 20081002; DE 102007014337 B4 20170706; CN 101642004 A 20100203; CN 101642004 B 20110824; EP 2130419 A1 20091209; JP 2010522439 A 20100701; JP 4848045 B2 20111228; US 2010084166 A1 20100408; WO 2008116677 A1 20081002
DOCDB simple family (application)
DE 102007014337 A 20070326; CN 200880009855 A 20080128; EP 08708260 A 20080128; EP 2008050937 W 20080128; JP 2010500155 A 20080128; US 53298108 A 20080128