EP 2132967 A1 20091216 - METHOD FOR THE PRODUCTION OF AN ELECTRONIC ASSEMBLY, AND ELECTRONIC ASSEMBLY
Title (en)
METHOD FOR THE PRODUCTION OF AN ELECTRONIC ASSEMBLY, AND ELECTRONIC ASSEMBLY
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN BAUGRUPPE SOWIE ELEKTRONISCHE BAUGRUPPE
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE ÉLECTRONIQUE ET MODULE ÉLECTRONIQUE
Publication
Application
Priority
- EP 2008051681 W 20080212
- DE 102007015819 A 20070330
Abstract (en)
[origin: WO2008119586A1] The invention relates to a method for the production of an electronic assembly (21), comprising at least one electronic component (9), wherein, in a first step, the at least one electronic component (9) is affixed to an insulating layer (5) of a conductive film (1), wherein the active side of the electronic component (9) is positioned toward the conductive film (1). In a second step, the conductive film (1) having the at least one electronic component (9) attached thereon is laminated onto a printed circuit board carrier (13), wherein the at least one electronic component (9) is positioned toward the printed circuit board carrier (13). As a final step conductors (15) are formed by the structuring of the conductive film (1), and the at least one electronic component (9) is contacted. The invention further relates to an electronic assembly, comprising at least one electronic component (9) that is connected to a conductor structure on a printed circuit board carrier (13). The at least one electronic component (9) is embedded in the printed circuit board carrier (13), and the conductor structure (15, 27) is disposed on the surface of the printed circuit board (23).
IPC 8 full level
H05K 1/18 (2006.01)
CPC (source: EP)
H01L 24/19 (2013.01); H01L 24/82 (2013.01); H05K 1/188 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19105 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 3/4602 (2013.01); H05K 3/4641 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09918 (2013.01)
Citation (search report)
See references of WO 2008119586A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102007015819 A1 20081009; CN 101682993 A 20100324; CN 101682993 B 20120321; EP 2132967 A1 20091216; JP 2010524213 A 20100715; JP 5150720 B2 20130227; WO 2008119586 A1 20081009
DOCDB simple family (application)
DE 102007015819 A 20070330; CN 200880018185 A 20080212; EP 08708914 A 20080212; EP 2008051681 W 20080212; JP 2010501455 A 20080212