EP 2133380 A1 20091216 - RESIN COMPOSITION
Title (en)
RESIN COMPOSITION
Title (de)
HARZZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE RÉSINE
Publication
Application
Priority
- JP 2008055554 W 20080325
- JP 2007078666 A 20070326
Abstract (en)
A resin composition comprising an epoxy compound denoted by the formula (1): wherein Ar 1 , Ar 2 and Ar 3 are the same or different and each denotes any one of divalent groups denoted by the following formulas: wherein R denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and an epoxy compound denoted by the formula (2): wherein R 5 denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and Q 2 denotes a single bond or a straight-chain alkylene group having 1 to 8 carbon atoms.
IPC 8 full level
C08G 59/24 (2006.01); C08G 59/02 (2006.01); C08J 5/24 (2006.01)
CPC (source: EP KR US)
C08G 59/02 (2013.01 - KR); C08G 59/226 (2013.01 - EP US); C08G 59/24 (2013.01 - KR); C08G 59/5033 (2013.01 - EP US); C08J 5/24 (2013.01 - EP KR US); C08L 63/00 (2013.01 - KR); C08J 2363/00 (2013.01 - EP US); H05K 1/0326 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2133380 A1 20091216; CN 101720336 A 20100602; JP 2008239679 A 20081009; KR 20090129487 A 20091216; TW 200844159 A 20081116; US 2010160555 A1 20100624; WO 2008123238 A1 20081016
DOCDB simple family (application)
EP 08722764 A 20080325; CN 200880017410 A 20080325; JP 2007078666 A 20070326; JP 2008055554 W 20080325; KR 20097022145 A 20080325; TW 97110693 A 20080326; US 45043108 A 20080325