EP 2134445 A2 20091223 - MIXTURE CONTAINING AN ORGANOMETALLIC SKELETAL MATERIAL, AND PCM DEVICE
Title (en)
MIXTURE CONTAINING AN ORGANOMETALLIC SKELETAL MATERIAL, AND PCM DEVICE
Title (de)
MISCHUNG ENTHALTEND EIN METALLORGANISCHES GERÜSTMATERIAL SOWIE EINEN LATENTWÄRMESPEICHER
Title (fr)
MÉLANGE CONTENANT UN MATÉRIAU STRUCTUREL ORGANOMÉTALLIQUE ET UN MATÉRIAU À CHANGEMENT DE PHASE
Publication
Application
Priority
- EP 2008053859 W 20080401
- EP 07105775 A 20070405
- EP 08735635 A 20080401
Abstract (en)
[origin: WO2008122542A2] The invention relates to mixtures each containing, in relation to the total weight of the mixture: a) between 2 and 60 wt. % of a PCM device constituent A, and b) between 40 and 98 wt. % of a skeletal material constituent B, constituent A containing at least one microencapsulated PCM device material, and constituent B containing at least one porous organometallic skeletal material containing at least one at least bidentate organic compound which is co-ordinately bound to at least one metal ion. The invention also relates to the use of such mixtures, especially in methods for separating materials from a material mixture.
IPC 8 full level
B01D 53/02 (2006.01); B01D 53/047 (2006.01); B01J 13/02 (2006.01); B01J 20/22 (2006.01); B01J 20/28 (2006.01); C09K 5/00 (2006.01); F17C 11/00 (2006.01)
CPC (source: EP KR US)
B01D 53/02 (2013.01 - EP KR US); B01J 13/14 (2013.01 - KR); B01J 20/22 (2013.01 - KR); B01J 20/226 (2013.01 - EP US); B01J 20/28004 (2013.01 - EP US); B01J 20/28014 (2013.01 - EP US); B01J 20/2803 (2013.01 - EP US); B01J 20/28042 (2013.01 - EP US); B01J 20/28054 (2013.01 - EP US); B01D 53/047 (2013.01 - EP US); B01D 2253/204 (2013.01 - EP US); B01D 2257/504 (2013.01 - EP US); Y02C 20/40 (2020.08 - EP US); Y02E 60/32 (2013.01 - EP US)
Citation (search report)
See references of WO 2008122542A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008122542 A2 20081016; WO 2008122542 A3 20081204; CN 101678266 A 20100324; EP 2134445 A2 20091223; JP 2010523308 A 20100715; KR 20100016186 A 20100212; US 2010126344 A1 20100527
DOCDB simple family (application)
EP 2008053859 W 20080401; CN 200880018890 A 20080401; EP 08735635 A 20080401; JP 2010501497 A 20080401; KR 20097022989 A 20080401; US 59434708 A 20080401