EP 2135964 B1 20140312 - Copper-based sliding material
Title (en)
Copper-based sliding material
Title (de)
Gleitmaterial auf Kupferbasis
Title (fr)
Matériau coulissant à base de cuivre
Publication
Application
Priority
JP 2008161635 A 20080620
Abstract (en)
[origin: EP2135964A2] A copper-based sliding material consisting of: 5.0 to 25.0 mass % of Zn; 4.2 to 10.0 mass % of Bi; 2.0 to 7.0 mass % of Mn; 1.0 to 3.0 mass % of Si; 0.1 to 2.0 mass % of Sn; and the balance being Cu and unavoidable impurities is provided. The copper-based sliding material includes a single ±-phase matrix (1, 2), a Mn-Si compound (3) and a Bi-particle phase (4). The Mn-Si compound (3) and the Bi-particle phase (4) are dispersed in the single ±-phase matrix (1, 2). The mass ratio of Sn to Bi is 0.024 to 0.200, preferably 0.050 to 0.140.
IPC 8 full level
C22C 9/04 (2006.01)
CPC (source: EP)
C22C 9/04 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2135964 A2 20091223; EP 2135964 A3 20130123; EP 2135964 B1 20140312; JP 2010001532 A 20100107; JP 5111253 B2 20130109
DOCDB simple family (application)
EP 09008100 A 20090619; JP 2008161635 A 20080620