Global Patent Index - EP 2136175 B1

EP 2136175 B1 20160622 - Heat transfer plate, plate pair, plate stack, compact plate heat exchanger and its manufacturing process

Title (en)

Heat transfer plate, plate pair, plate stack, compact plate heat exchanger and its manufacturing process

Title (de)

Wärmeübertragungsplatte, Plattenpaar, Plattenpaket und Kompaktplattenwärmeüberträger sowie Verfahren zur Herstellung eines Kompaktplattenwärmeüberträgers

Title (fr)

Plaque d'échange de chaleur, paire de plaques, pile de plaques, échangeur de chaleur à plaques compactes et son procédé de fabriquation

Publication

EP 2136175 B1 20160622 (DE)

Application

EP 08011315 A 20080621

Priority

EP 08011315 A 20080621

Abstract (en)

[origin: EP2136175A1] The plate (3) has a thermal active surface (17) limited on both sides by plate sections (12, 12a) with a passage opening (8, 9). The plate sections are formed outside the surface and diagonally offset to the plate. The plate sections are attached to the surface so that the surface flows directly over the opening. A circumferential profile-free welded edge (20) at front transitions (6, 6a) from the limitation of the surface to the plate sections and diagonally opposite edges (7, 7a) of the surface are formed with radii corresponding to a same radius that the plate sections revolves. An independent claim is also included for a compact plate heat exchanger with a profiled rectangular heat transfer plate.

IPC 8 full level

F28D 9/00 (2006.01); F28F 3/04 (2006.01); F28F 9/00 (2006.01)

CPC (source: EP)

F28D 9/0006 (2013.01); F28D 9/0043 (2013.01); F28F 3/046 (2013.01); F28F 9/00 (2013.01); F28F 2225/02 (2013.01); F28F 2275/06 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2136175 A1 20091223; EP 2136175 B1 20160622

DOCDB simple family (application)

EP 08011315 A 20080621