Global Patent Index - EP 2137337 A2

EP 2137337 A2 20091230 - PLASMA-DEPOSITED ELECTRICALLY INSULATING, DIFFUSION-RESISTANT AND ELASTIC LAYER SYSTEM

Title (en)

PLASMA-DEPOSITED ELECTRICALLY INSULATING, DIFFUSION-RESISTANT AND ELASTIC LAYER SYSTEM

Title (de)

PLASMADEPONIERTES ELEKTRISCH ISOLIERENDES, DIFFUSIONSDICHTES UND ELASTISCHES SCHICHTSYSTEM

Title (fr)

SYSTÈME STRATIFIÉ ÉLASTIQUE, ÉTANCHE À LA DIFFUSION, ÉLECTRIQUEMENT ISOLANT ET DÉPOSÉ PAR PLASMA

Publication

EP 2137337 A2 20091230 (DE)

Application

EP 08707792 A 20080222

Priority

  • EP 2008001388 W 20080222
  • DE 102007008861 A 20070223

Abstract (en)

[origin: WO2008101704A2] A multilayer system on a substrate, the multilayer system being applied to the substrate by plasma deposition, characterized in that the multilayer system is configured such that it has substantial diffusion resistance to ions in an aqueous solution, wherein the current produced by the diffusion of the ions with the connection of an electric field gradient of more than 10<SUP>4</SUP>V/m, preferably more than 10<SUP>5</SUP>V/m, most preferred more than 10<SUP>7</SUP>V/m is I<SUB>Ion</SUB> < 6,5X10<SUP>-8</SUP> A/cm<SUP>2</SUP>, preferably I<SUB>Ion</SUB> < 6,5X10 <SUP>-10</SUP> A/cm<SUP>2</SUP>, particularly I<SUB>Ion</SUB> < 1X10<SUP>-12</SUP> A/cm<SUP>2</SUP>.

IPC 8 full level

C23C 16/26 (2006.01); A61N 1/375 (2006.01); B05D 7/24 (2006.01); C23C 16/40 (2006.01); H01L 51/52 (2006.01)

CPC (source: EP US)

A61N 1/375 (2013.01 - EP US); A61N 1/37512 (2017.07 - EP US); C23C 16/26 (2013.01 - EP US); C23C 16/45523 (2013.01 - EP US); A61N 1/05 (2013.01 - EP US); H10K 50/8445 (2023.02 - US); Y10T 428/30 (2015.01 - EP US); Y10T 428/31504 (2015.04 - EP US)

Citation (search report)

See references of WO 2008101704A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2008101704 A2 20080828; WO 2008101704 A3 20090129; EP 2137337 A2 20091230; US 2011122486 A1 20110526

DOCDB simple family (application)

EP 2008001388 W 20080222; EP 08707792 A 20080222; US 52832008 A 20080222