EP 2138594 A1 20091230 - MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM ALLOY CAST
Title (en)
MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM ALLOY CAST
Title (de)
MAGNESIUMLEGIERUNG FÜR GUSS UND MAGNESIUMLEGIERUNGSGUSS
Title (fr)
ALLIAGE DE MAGNÉSIUM POUR LA COULÉE ET PIÈCE COULÉE D'ALLIAGE DE MAGNÉSIUM
Publication
Application
Priority
- JP 2008057644 W 20080414
- JP 2007112052 A 20070420
Abstract (en)
A magnesium alloy for casting according to the present invention is characterized in that , when the entirety is taken as 100% by mass, it includes copper (Cu) in an amount of from 1% by mass or more to 5% by mass or less, calcium (Ca) in an amount of from 0.1% by mass or more to 5% by mass or less, silver (Ag) in an amount of from 0.1% by mass or more to 5% by mass or less, and the balance comprising magnesium (Mg) and inevitable impurities. By means of including Cu and Ca, crystallized substances of Mg-Ca compounds crystallize in crystalline grain boundaries between Mg crystalline grains as three-dimensionally mesh shapes, along with Mg-Cu compounds. By means of the three-dimensionally mesh constructions, grain-boundary sliding, which becomes active especially when becoming high temperature, is suppressed, and thereby high-temperature strength and creep resistance at high temperature improve. Moreover, by means of the Ag addition, the Mg crystalline grains become micro-fine and thereby the three-dimensionally mesh constructions, whose continuities are high and which are fine, are formed. In addition, it is less likely that Ag affects the heat conductivity of magnesium alloy adversely.
IPC 8 full level
C22C 23/00 (2006.01); B22D 21/04 (2006.01)
CPC (source: EP US)
B22D 21/007 (2013.01 - EP US); C22C 23/00 (2013.01 - EP US)
Citation (search report)
See references of WO 2008133217A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2138594 A1 20091230; JP 2008266734 A 20081106; US 2010119405 A1 20100513; WO 2008133217 A1 20081106
DOCDB simple family (application)
EP 08740690 A 20080414; JP 2007112052 A 20070420; JP 2008057644 W 20080414; US 59681008 A 20080414