Global Patent Index - EP 2138595 A1

EP 2138595 A1 20091230 - MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM ALLOY CAST

Title (en)

MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM ALLOY CAST

Title (de)

MAGNESIUMLEGIERUNG FÜR GUSS UND MAGNESIUMLEGIERUNGSGUSS

Title (fr)

ALLIAGE DE MAGNÉSIUM POUR LA COULÉE ET PIÈCE COULÉE D'ALLIAGE DE MAGNÉSIUM

Publication

EP 2138595 A1 20091230 (EN)

Application

EP 08740692 A 20080414

Priority

  • JP 2008057646 W 20080414
  • JP 2007112014 A 20070420

Abstract (en)

Amagnesiumalloy for casting according to the present invention is characterized in that , when the entirety is taken as 100% by mass, it includes copper (Cu) in an amount of from 1% by mass or more to 5% by mass or less, calcium (Ca) in an amount of from 0.1% by mass or more to 5% by mass or less, tin (Sn) in an amount of from 0.1 or more to 3 or less by mass ratio with respect to the Ca (Sn/Ca); and the balance comprising magnesium (Mg) and inevitable impurities. By means of including Cu, Ca and Sn, crystallized substances of Mg-Ca-Sn compounds crystallize in crystalline grain boundaries between Mg crystalline grains as network shapes (three-dimensionally mesh shapes), along with Mg-Cu compounds. By means of the three-dimensionally mesh constructions, grain-boundary sliding, which becomes active especially when becoming high temperature, is suppressed, and thereby high-temperature strength and creep resistance at high temperature improve. Moreover, since Sn forms compounds with Ca preferentially, it influence less on the heat conductivity, compared with the other additive elements.

IPC 8 full level

C22C 23/00 (2006.01); B22D 21/04 (2006.01)

CPC (source: EP US)

B22D 21/007 (2013.01 - EP US); C22C 23/00 (2013.01 - EP US)

Citation (search report)

See references of WO 2008133218A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2138595 A1 20091230; JP 2008266733 A 20081106; US 2010209285 A1 20100819; WO 2008133218 A1 20081106

DOCDB simple family (application)

EP 08740692 A 20080414; JP 2007112014 A 20070420; JP 2008057646 W 20080414; US 59681508 A 20080414