Global Patent Index - EP 2140073 B1

EP 2140073 B1 20101027 - Joining arrangement comprising a joining device

Title (en)

Joining arrangement comprising a joining device

Title (de)

Verbindungsvorrichtung enthaltende Verbindungsanordnung

Title (fr)

Arrangement de liaison comportant un dispositif de liaison

Publication

EP 2140073 B1 20101027 (EN)

Application

EP 08741707 A 20080318

Priority

  • NO 2008000110 W 20080318
  • NO 20071453 A 20070319

Abstract (en)

[origin: WO2008115075A1] The present invention relates to a device for joining two building elements (1, 2), for example a column and a beam, which device comprises a first element (3) secured to one of the building elements (1, 2) and adapted for cooperation with a bridge element (5) which in a working position is in contact with both the first and second building element (1, 2), connecting the building elements (1, 2). The first element (3) is embedded in the building element (1, 2) with an elastic sleeve (10) arranged between the first element (3) and the building element (1, 2), where the elastic sleeve (10) is provided with at least one internal groove (17), thereby forming at least one cavity between the elastic sleeve (10) and the first element (3). The invention also relates to a device where the bridge element (5) is provided with a corresponding elastic sleeve (10), and the use of an elastic sleeve.

IPC 8 full level

E04B 1/21 (2006.01)

CPC (source: EP US)

E04B 1/215 (2013.01 - EP US); E04B 1/483 (2013.01 - EP US); E04B 2001/8254 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2008115075 A1 20080925; AT E486177 T1 20101115; CN 101715501 A 20100526; CN 101715501 B 20120516; DE 602008003213 D1 20101209; DK 2140073 T3 20110214; EP 2140073 A1 20100106; EP 2140073 B1 20101027; ES 2355014 T3 20110322; NO 20071453 L 20080922; NO 326748 B1 20090209; US 2010313518 A1 20101216

DOCDB simple family (application)

NO 2008000110 W 20080318; AT 08741707 T 20080318; CN 200880009007 A 20080318; DE 602008003213 T 20080318; DK 08741707 T 20080318; EP 08741707 A 20080318; ES 08741707 T 20080318; NO 20071453 A 20070319; US 53206608 A 20080318