Global Patent Index - EP 2140485 A1

EP 2140485 A1 20100106 - METHOD AND DEVICE FOR PRODUCING A BOND CONNECTION

Title (en)

METHOD AND DEVICE FOR PRODUCING A BOND CONNECTION

Title (de)

VERFAHREN UND VORRICHTUNG ZUM HERSTELLEN EINER BONDVERBINDUNG

Title (fr)

PROCÉDÉ ET DISPOSITIF DE FABRICATION D'UNE LIAISON PAR SOUDAGE

Publication

EP 2140485 A1 20100106 (DE)

Application

EP 08717787 A 20080313

Priority

  • EP 2008053043 W 20080313
  • DE 102007014762 A 20070328

Abstract (en)

[origin: WO2008116761A1] The invention relates to a method for producing a bond connection between a conductor and a conductor substrate having a surface protection layer, particularly having an organic solder mask surface protection layer. According to the invention, prior to attaching the conductor (12) to the conductor substrate (3), the surface protection layer (2) is at least partially removed from the attachment site (15) by applying electromagnetic waves. The invention further relates to a device for producing a bond connection between a conductor and a conductor substrate having a surface protection layer, particularly having an organic solder mask surface protection layer. According to the invention, at least one device for generating electromagnetic waves is provided, which at least partially removes the surface protection layer (2) from the attachment site (15) prior to attaching the conductor (12) to the conductor substrate (3).

IPC 8 full level

H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 21/607 (2006.01)

CPC (source: EP)

H01L 24/78 (2013.01); H01L 24/85 (2013.01); H05K 3/3489 (2013.01); H01L 24/48 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/78 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/8501 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85214 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H05K 3/0032 (2013.01); H05K 3/282 (2013.01); H05K 2203/049 (2013.01); H05K 2203/107 (2013.01)

Citation (search report)

See references of WO 2008116761A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 102007014762 A1 20081002; EP 2140485 A1 20100106; WO 2008116761 A1 20081002

DOCDB simple family (application)

DE 102007014762 A 20070328; EP 08717787 A 20080313; EP 2008053043 W 20080313