EP 2142489 A1 20100113 - COMPONENT HAVING A CERAMIC BASE WITH A METALIZED SURFACE
Title (en)
COMPONENT HAVING A CERAMIC BASE WITH A METALIZED SURFACE
Title (de)
BAUTEIL MIT EINEM KERAMISCHEN KÖRPER MIT METALLISIERTER OBERFLÄCHE
Title (fr)
COMPOSANT COMPRENANT UN CORPS CÉRAMIQUE QUI PRÉSENTE UNE SURFACE MÉTALLISÉE
Publication
Application
Priority
- EP 2008054626 W 20080417
- DE 102007019633 A 20070424
Abstract (en)
[origin: WO2008128945A1] It is difficult to dissipate the heat produced during the operation of components having flat metalized ceramic bases, especially if the ceramic bases are metalized on both surfaces. The component (1) according to the invention has a ceramic base (2) the surface (3, 4) of which is covered in at least one area by a metalized coating (5, 6), the ceramic base (2) being spatially structured (7).
IPC 8 full level
C04B 37/02 (2006.01); H01L 23/40 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP KR US)
C04B 37/02 (2013.01 - KR); C04B 37/021 (2013.01 - EP US); C04B 37/026 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 23/367 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 23/40 (2013.01 - KR); H05K 1/0203 (2013.01 - EP US); H05K 1/0284 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 1/09 (2013.01 - KR); H05K 3/38 (2013.01 - KR); C04B 2237/121 (2013.01 - EP US); C04B 2237/122 (2013.01 - EP US); C04B 2237/123 (2013.01 - EP US); C04B 2237/124 (2013.01 - EP US); C04B 2237/125 (2013.01 - EP US); C04B 2237/34 (2013.01 - EP US); C04B 2237/343 (2013.01 - EP US); C04B 2237/348 (2013.01 - EP US); C04B 2237/365 (2013.01 - EP US); C04B 2237/366 (2013.01 - EP US); C04B 2237/368 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01012 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01021 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H05K 1/181 (2013.01 - EP US); H05K 2201/09045 (2013.01 - EP US); Y10T 428/24174 (2015.01 - EP US); Y10T 428/24182 (2015.01 - EP US); Y10T 428/26 (2015.01 - EP US); Y10T 428/31678 (2015.04 - EP US)
Citation (search report)
See references of WO 2008128945A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102008001221 A1 20081030; CN 101687718 A 20100331; EP 2142489 A1 20100113; JP 2010524830 A 20100722; JP 5649958 B2 20150107; KR 101519925 B1 20150514; KR 20100017331 A 20100216; US 2010089625 A1 20100415; US 8980398 B2 20150317; WO 2008128945 A1 20081030
DOCDB simple family (application)
DE 102008001221 A 20080417; CN 200880021678 A 20080417; EP 08736299 A 20080417; EP 2008054626 W 20080417; JP 2010504631 A 20080417; KR 20097024487 A 20080417; US 59686408 A 20080417