EP 2142490 A1 20100113 - METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION
Title (en)
METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES METALLISIERTEN BAUTEILS, BAUTEIL SOWIE EINEN TRÄGER ZUR AUFLAGE DES BAUTEILS BEI DER METALLISIERUNG
Title (fr)
PROCÉDÉ DE RÉALISATION D'UN COMPOSANT MÉTALLISÉ, COMPOSANT ET SUPPORT SUR LEQUEL LE COMPOSANT REPOSE LORS DE LA MÉTALLISATION
Publication
Application
Priority
- EP 2008054628 W 20080417
- DE 102007019630 A 20070424
Abstract (en)
[origin: WO2008128947A1] When components having ceramic bases are provided with a metalized structure on at least two opposite and/or juxtaposed faces at the same time, it is very difficult to stack said bases. According to the invention, the metal in the form of pastes, films or sheets provided for metalization is applied to the surfaces of the ceramic base to be provided with a metalized structure. Before the metal is joined to the ceramic material, the at least one component is placed on a substrate and a stack is formed, the substrate being previously provided with a separation layer on a face of the substrate on those surfaces intended for support on the at least one component. The at least one component is lifted off the substrate after metalization.
IPC 8 full level
C04B 37/02 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP KR US)
C04B 37/02 (2013.01 - KR); C04B 37/021 (2013.01 - EP US); C04B 37/026 (2013.01 - EP US); H01L 21/481 (2013.01 - EP US); H01L 21/4867 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 23/373 (2013.01 - KR); C04B 2237/122 (2013.01 - EP US); C04B 2237/123 (2013.01 - EP US); C04B 2237/124 (2013.01 - EP US); C04B 2237/125 (2013.01 - EP US); C04B 2237/34 (2013.01 - EP US); C04B 2237/343 (2013.01 - EP US); C04B 2237/348 (2013.01 - EP US); C04B 2237/402 (2013.01 - EP US); C04B 2237/403 (2013.01 - EP US); C04B 2237/405 (2013.01 - EP US); C04B 2237/406 (2013.01 - EP US); C04B 2237/407 (2013.01 - EP US); C04B 2237/408 (2013.01 - EP US); C04B 2237/64 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10T 428/31678 (2015.04 - EP US)
Citation (search report)
See references of WO 2008128947A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102008001224 A1 20081030; CN 101687716 A 20100331; CN 101687716 B 20131113; EP 2142490 A1 20100113; JP 2010524736 A 20100722; JP 5496081 B2 20140521; KR 101476313 B1 20141224; KR 20100021417 A 20100224; US 2010132932 A1 20100603; WO 2008128947 A1 20081030
DOCDB simple family (application)
DE 102008001224 A 20080417; CN 200880021605 A 20080417; EP 08736301 A 20080417; EP 2008054628 W 20080417; JP 2010504632 A 20080417; KR 20097024477 A 20080417; US 59689508 A 20080417