EP 2143310 A1 20100113 - METHOD FOR THE SELECTIVE SURFACE TREATMENT OF NON-FLAT WORKPIECES
Title (en)
METHOD FOR THE SELECTIVE SURFACE TREATMENT OF NON-FLAT WORKPIECES
Title (de)
VERFAHREN ZUR SELEKTIVEN OBERFLÄCHENBEHANDLUNG VON NICHT PLATTENFÖRMIGEN WERKSTÜCKEN
Title (fr)
PROCÉDÉ DE TRAITEMENT DE SURFACE SÉLECTIF POUR PIÈCES NON PLATES
Publication
Application
Priority
- EP 2008054623 W 20080417
- DE 102007019634 A 20070424
Abstract (en)
[origin: WO2008128943A1] The invention relates to a method for the selective surface treatment of a first workpiece (1) on at least one of the metalized areas (3) of its upper (4) and/or underside (5), the first workpiece (1) being releasably joined to at least one additional workpiece (2) on one of its faces (4, 5) so as to be sealed from the exterior in at least one partial area and the selective surface treatment of the areas not covered by the joined section being carried out in a treatment phase. In order to make cooling and distribution of the metalized areas easier, the at least first workpiece (1) is not configured as a flat structure and is provided on at least one face with identically or differently metalized or non-metalized areas (3) or cavities or combinations thereof either across the whole surface or part of the surface and at least one additional metallic protective layer or an additional metallic coating is applied during the selective surface treatment.
IPC 8 full level
H05K 3/00 (2006.01)
CPC (source: EP KR US)
H05K 3/0097 (2013.01 - EP KR US); C25D 5/02 (2013.01 - KR); C25D 7/00 (2013.01 - KR); H05K 1/0284 (2013.01 - EP KR US); H05K 3/244 (2013.01 - EP KR US); H05K 2201/0347 (2013.01 - EP KR US); H05K 2203/1147 (2013.01 - EP KR US); H05K 2203/1536 (2013.01 - EP KR US)
Citation (examination)
US 2002062987 A1 20020530 - UCHINONO YOSHIYUKI [JP], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102008001218 A1 20081030; CN 101690427 A 20100331; EP 2143310 A1 20100113; JP 2010530027 A 20100902; JP 5737934 B2 20150617; KR 20100017314 A 20100216; US 2010147795 A1 20100617; WO 2008128943 A1 20081030
DOCDB simple family (application)
DE 102008001218 A 20080417; CN 200880021668 A 20080417; EP 08736296 A 20080417; EP 2008054623 W 20080417; JP 2010504629 A 20080417; KR 20097024459 A 20080417; US 59684308 A 20080417