EP 2145697 A2 20100120 - Ultrasonic probe, ultrasonic diagnostic apparatus and ultrasonic endoscopic apparatus
Title (en)
Ultrasonic probe, ultrasonic diagnostic apparatus and ultrasonic endoscopic apparatus
Title (de)
Ultraschallsonde, Ultraschalldiagnosegerät und endoskopische Ultraschallvorrichtung
Title (fr)
Sonde ultrasonique, appareil de diagnostic ultrasonique et appareil endoscopique ultrasonique
Publication
Application
Priority
JP 2008130755 A 20080519
Abstract (en)
An ultrasonic probe in which a balance between basic performance and suppression of heat generation is achieved by suppressing heat generation of the ultrasonicprobe without degrading sensitivity and relative bandwidth of the ultrasonic probe in transmission and reception of ultrasonic waves. The ultrasonic probe includes at least one vibrator 2 for transmitting and receiving ultrasonic waves, the at least one vibrator 2 including a piezoelectric material in which a piezoelectric strain constant d33 is equal to or less than 500pm/V and aproduct of the piezoelectric strain constant d33 and a piezoelectric voltage constant g33 is equal to or more than 7000×10 -15 m 2 /N, at least one acoustic matching layer 4a, 4b provided on a first surface of the at least one vibrator 2, and a backing material 1 provided on a second surface opposite to the first surface of the at least one vibrator 2.
IPC 8 full level
CPC (source: EP US)
A61B 8/12 (2013.01 - EP US); B06B 1/0607 (2013.01 - EP US); B06B 1/0644 (2013.01 - EP US); A61B 8/445 (2013.01 - EP US)
Citation (applicant)
- JP H0551222 A 19930302 - SUMITOMO METAL IND
- JP H0614398 A 19940121 - NIHON DEMPA KOGYO CO
- MICHAEL J. ZIPPARO: "Proc.", 2005, IEEE ULTRASONICS SYMPOSIUM, article "Multilayer Ultrasound Imaging Arrays showing Improved Thermal Performance", pages: 2235 - 2238
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
US 2009287086 A1 20091119; US 8216142 B2 20120710; EP 2145697 A2 20100120; JP 2009273838 A 20091126
DOCDB simple family (application)
US 43488109 A 20090504; EP 09006538 A 20090514; JP 2008130755 A 20080519