Global Patent Index - EP 2147478 A1

EP 2147478 A1 20100127 - MICROSTRIP TECHNOLOGY HYPERFREQUENCY SIGNAL COUPLER

Title (en)

MICROSTRIP TECHNOLOGY HYPERFREQUENCY SIGNAL COUPLER

Title (de)

HYPERFREQUENZSIGNALKOPPLER MIT MIKROSTREIFENTECHNOLOGIE

Title (fr)

COUPLEUR DE SIGNAUX HYPERFREQUENCES EN TECHNOLOGIE MICRORUBAN

Publication

EP 2147478 A1 20100127 (FR)

Application

EP 08749916 A 20080430

Priority

  • EP 2008055327 W 20080430
  • FR 0703381 A 20070511

Abstract (en)

[origin: WO2008141902A1] The invention relates to a power coupler for hyperfrequency signals. The mono-section coupler (1) with microstrip lines includes a dielectric substrate (3), a main line (10) and a secondary line (20) including a coupling section (23, 24, 25), the lines being arranged on the substrate (3), the main line (10) being substantially rectilinear and even along its entire length, the coupling section (23, 24, 25) including a protrusion (24, 25) at each end (23a, 23b) thereof, the protrusions (24, 25) being connected together by a conducting line portion (23) having a section, a shape and an arrangement adapted for minimising the coupling between said portion (23) and the main line (10) relative to the coupling between the protrusions (24, 25) and the main line (10). The invention also relates to the measure of the power of a signal passing through a transmission line.

IPC 8 full level

H01P 5/18 (2006.01)

CPC (source: EP US)

H01P 5/184 (2013.01 - EP US)

Citation (search report)

See references of WO 2008141902A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

FR 2916086 A1 20081114; FR 2916086 B1 20100903; EP 2147478 A1 20100127; EP 2147478 B1 20170719; US 2010194490 A1 20100805; US 8314664 B2 20121120; WO 2008141902 A1 20081127

DOCDB simple family (application)

FR 0703381 A 20070511; EP 08749916 A 20080430; EP 2008055327 W 20080430; US 59959808 A 20080430