EP 2148639 A2 20100203 - APPARATUS AND METHODS FOR DEPLOYING SELF-EXPANDING STENTS
Title (en)
APPARATUS AND METHODS FOR DEPLOYING SELF-EXPANDING STENTS
Title (de)
VORRICHTUNG UND VERFAHREN ZUM EINSETZEN SELBSTEXPANDIERENDER STENTS
Title (fr)
DISPOSITIF ET PROCÉDÉS DESTINÉS À LA MISE EN PLACE DE STENTS AUTO-EXPANSIBLES
Publication
Application
Priority
- US 2008006643 W 20080523
- US 80580307 A 20070524
Abstract (en)
[origin: US2008294230A1] Apparatus and methods are provided for improved deployment of self-expanding stents. One advantage of the improved delivery system is that energy storage within a portion of an outer sheath and/or an inner tube may be reduced during the deployment of the stent. In a first embodiment, the outer sheath and the inner tube may be coupled together using a plurality of engaging threaded members, such that circumferential rotation of the inner tube with respect to the outer sheath retracts the outer sheath to deploy the stent. In an alternative embodiment, a fluid reservoir may be provided between the inner tube and the outer sheath. A proximal sealing ring may be disposed annularly between the inner tube and the outer sheath, such that when the fluid reservoir is filled, the proximal sealing ring is urged proximally to engage and retract the outer sheath. Using these techniques, energy build-up in the outer sheath and/or inner tube may be substantially reduced and improved accuracy in deploying the stent may be achieved.
IPC 8 full level
A61F 2/84 (2006.01)
CPC (source: EP US)
A61F 2/95 (2013.01 - EP US); A61F 2/966 (2013.01 - EP US)
Citation (search report)
See references of WO 2008153765A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
US 2008294230 A1 20081127; EP 2148639 A2 20100203; JP 2010527694 A 20100819; WO 2008153765 A2 20081218; WO 2008153765 A3 20090205
DOCDB simple family (application)
US 80580307 A 20070524; EP 08767869 A 20080523; JP 2010509401 A 20080523; US 2008006643 W 20080523