EP 2150972 A2 20100210 - Method for assembling an electronic module comprising an element assembled onto a carrier by sintering a conducting powder
Title (en)
Method for assembling an electronic module comprising an element assembled onto a carrier by sintering a conducting powder
Title (de)
Verfahren zur Montage eines elektronischen Moduls mit einem auf einem Träger durch Sintern einer leitenden pulverförmigen Masse montierten Bauelement
Title (fr)
Procédé d'assemblage d'un module électronique comprenant un organe assemblé sur un support par frittage d'une masse de poudre conductrice
Publication
Application
Priority
- FR 2008050741 W 20080423
- FR 0754807 A 20070430
Abstract (en)
[origin: WO2008145930A2] The method of the invention comprises placing the mass (16) on a holder (14) and the member (12) on the mass (16) and applying a compression force of the member (12) against the mass (16) and the holder (14) before heating the mass (16). The intensity is increased from an initial value up to a predetermined agglomeration value of the mass (16) lower than a plastic deformation threshold of the mass (16). The method then comprises maintaining the intensity at the first predetermined value for a predetermined agglomeration duration of the mass (16). Finally, the method comprises increasing the intensity from the first value to a second predetermined value lower than a critical damage threshold of the member (12) but higher than a minimum sintering threshold of the mass (16) for a predetermined temperature, the second predetermined value being higher than the first predetermined value.
IPC 8 full level
H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 24/75 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/743 (2013.01 - EP US); H01L 2224/29294 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/75 (2013.01 - EP US); H01L 2224/75745 (2013.01 - EP US); H01L 2224/83047 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/83203 (2013.01 - EP US); H01L 2224/83208 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2224/83908 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US)
Citation (search report)
See references of WO 2008145930A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
FR 2915622 A1 20081031; FR 2915622 B1 20090731; EP 2150972 A2 20100210; EP 2150972 B1 20180912; US 2010176098 A1 20100715; US 8444913 B2 20130521; WO 2008145930 A2 20081204; WO 2008145930 A3 20090305
DOCDB simple family (application)
FR 0754807 A 20070430; EP 08805695 A 20080423; FR 2008050741 W 20080423; US 59835908 A 20080423