EP 2152918 A1 20100217 - NOVEL ADDITIVE COMPRISING LEAD AND/OR A LEAD ALLOY INTENDED TO TREAT BATHS OF LIQUID STEEL
Title (en)
NOVEL ADDITIVE COMPRISING LEAD AND/OR A LEAD ALLOY INTENDED TO TREAT BATHS OF LIQUID STEEL
Title (de)
NEUARTIGER ZUSATZSTOFF MIT BLEI UND/ODER EINER BLEILEGIERUNG ZUR BEARBEITUNG VON FLÜSSIGSTAHLBÄDERN
Title (fr)
NOUVEL ADDITIF COMPRENANT DU PLOMB ET/OU UN ALLIAGE DE PLOMB DESTINE A TRAITER LES BAINS D'ACIER LIQUIDE
Publication
Application
Priority
- FR 2008050989 W 20080604
- FR 0755486 A 20070605
Abstract (en)
[origin: WO2008152328A1] The present invention relates to an additive in the form of flux-cored wire intended for treating baths of liquid steel with a view to obtaining steels having a high lead content. The additive comprising metallic lead and/or one or more lead alloys according to the invention is intended to treat baths of liquid steel, and is in the form of flex-cored wire composed of a metal sheath and a finely divided filling material, the latter being composed of a powder of metallic lead and/or of lead alloy and of a powder containing a material capable of releasing a gas, which is inert with respect to the liquid steel, at the temperature of the liquid steel bath. Characteristically, said powder of metallic lead and/or of lead alloy consists of a particle size fraction GR between 200 µm and 500 µm and in that said particle size fraction GR has the following characteristics: - through a 200 µm sieve: GR < 5%; - through a 300 µm sieve: 90% ~ GR ~ 10%; - through a 400 µm sieve: 40%£ GR < 100%; - through a 500 µm sieve: 100% ~ GR ~ 90%.
IPC 8 full level
C21C 7/00 (2006.01)
CPC (source: EP US)
C21C 7/0056 (2013.01 - EP US); C22C 33/00 (2013.01 - EP US)
Citation (search report)
See references of WO 2008152328A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
FR 2917096 A1 20081212; FR 2917096 B1 20110311; EP 2152918 A1 20100217; EP 2152918 B1 20120815; ES 2392736 T3 20121213; JP 2010529297 A 20100826; JP 5466153 B2 20140409; MX 2009013264 A 20100218; US 2010172787 A1 20100708; WO 2008152328 A1 20081218
DOCDB simple family (application)
FR 0755486 A 20070605; EP 08805930 A 20080604; ES 08805930 T 20080604; FR 2008050989 W 20080604; JP 2010510854 A 20080604; MX 2009013264 A 20080604; US 66307008 A 20080604