Global Patent Index - EP 2152923 A4

EP 2152923 A4 20120328 - ALUMINUM ALLOY FORMULATIONS FOR REDUCED HOT TEAR SUSCEPTIBILITY

Title (en)

ALUMINUM ALLOY FORMULATIONS FOR REDUCED HOT TEAR SUSCEPTIBILITY

Title (de)

ALUMINIUMLEGIERUNGSFORMULIERUNGEN FÜR VERMINDERTE WÄRMERISSANFÄLLIGKEIT

Title (fr)

FORMULATIONS D'ALLIAGE D'ALUMINIUM À SENSIBILITÉ RÉDUITE AU CRIQUAGE À CHAUD

Publication

EP 2152923 A4 20120328 (EN)

Application

EP 08757187 A 20080529

Priority

  • CA 2008001051 W 20080529
  • US 94120707 P 20070531

Abstract (en)

[origin: WO2008144935A1] The present invention relates to modified alloy compositions for reduced hot tear susceptibility, where the aluminum alloy comprising from 0.01 to 0.025 % by weight of Sr; and TiB2, measured by its boron content, from 0.001 to 0.005% by weight of B. The invention also relates to method of preventing or eliminating hot tears in an aluminum alloy comprising the step of combining with aluminum from 0.01to 0.025 % by weight of Sr; and TiB2, measured by its boron content, from 0.001 to 0.005% by weight of B.

IPC 8 full level

B22D 17/22 (2006.01); B22D 17/00 (2006.01); B22D 21/00 (2006.01); B22D 21/04 (2006.01); C22C 1/02 (2006.01); C22C 1/03 (2006.01); C22C 1/06 (2006.01); C22C 21/00 (2006.01); C22C 21/06 (2006.01); C22C 21/08 (2006.01); C22C 21/12 (2006.01); C22C 21/14 (2006.01); C22C 21/16 (2006.01); C22F 1/05 (2006.01)

CPC (source: EP US)

B22D 17/007 (2013.01 - EP US); B22D 21/007 (2013.01 - EP US); C22C 1/026 (2013.01 - EP US); C22C 1/03 (2013.01 - EP US); C22C 1/06 (2013.01 - EP US); C22C 21/00 (2013.01 - EP US); C22C 21/06 (2013.01 - EP US); C22C 21/08 (2013.01 - EP US); C22C 21/12 (2013.01 - EP US); C22C 21/14 (2013.01 - EP US); C22C 21/16 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2008144935 A1 20081204; CA 2687893 A1 20081204; EP 2152923 A1 20100217; EP 2152923 A4 20120328; JP 2010528187 A 20100819; US 2008299001 A1 20081204

DOCDB simple family (application)

CA 2008001051 W 20080529; CA 2687893 A 20080529; EP 08757187 A 20080529; JP 2010509649 A 20080529; US 12760808 A 20080527