EP 2155434 A1 20100224 - STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS
Title (en)
STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS
Title (de)
GESTAPELTE POLIERSCHEIBE FÜR HOCHTEMPERATURANWENDUNGEN
Title (fr)
TAMPON À POLIR À COUCHES EMPILÉES POUR DES APPLICATIONS HAUTE TEMPÉRATURE
Publication
Application
Priority
- US 2008005622 W 20080501
- US 74392207 A 20070503
Abstract (en)
[origin: US2008274674A1] The invention provides a polishing pad for chemical-mechanical polishing comprising a polishing layer, a bottom layer, and a hot-melt adhesive, the hot-melt adhesive joining together the polishing layer and the bottom layer. The hot-melt adhesive comprises between about 2 and about 18 wt. % EVA and is substantially resistant to delamination when the polishing layer attains a temperature of about 40° C. The invention also provides a method of polishing a substrate with the aforementioned polishing pad, as well as a method of preparing such a polishing pad.
IPC 8 full level
B24B 37/00 (2006.01); H01L 21/30 (2006.01)
CPC (source: EP KR US)
B24B 37/22 (2013.01 - EP KR US); B24B 37/24 (2013.01 - EP KR US); B24D 3/20 (2013.01 - KR); H01L 21/304 (2013.01 - KR)
Citation (search report)
See references of WO 2008137033A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
US 2008274674 A1 20081106; CN 101687307 A 20100331; EP 2155434 A1 20100224; JP 2010525956 A 20100729; KR 20100017564 A 20100216; TW 200909137 A 20090301; WO 2008137033 A1 20081113
DOCDB simple family (application)
US 74392207 A 20070503; CN 200880021244 A 20080501; EP 08754175 A 20080501; JP 2010506320 A 20080501; KR 20097025140 A 20080501; TW 97116018 A 20080430; US 2008005622 W 20080501