EP 2157199 A4 20120627 - COPPER ALLOY MATERIAL, AND METHOD FOR PRODUCTION THEREOF
Title (en)
COPPER ALLOY MATERIAL, AND METHOD FOR PRODUCTION THEREOF
Title (de)
KUPFERLEGIERUNGSMATERIAL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MATÉRIAU D'ALLIAGE DU CUIVRE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- JP 2008056196 W 20080328
- JP 2007086026 A 20070328
- JP 2008085013 A 20080327
Abstract (en)
[origin: EP2157199A1] A copper alloy material according to the present invention is characterized in that the copper alloy material includes: an element X between 0.1% and 4% by mass, in which the element X represents one transition element or not less than two elements selected from Ni, Fe, Co and Cr; an element Y between 0.01% and 3% by mass, in which the element Y represents one element or not less than two elements selected from Ti, Si, Zr and Hf; and a remaining portion to be comprised of copper and an unavoidable impurity, wherein the copper alloy material has an electrical conductivity of not less than 50% IACS, an yield strength of not less than 600 MPa, and a stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength.
IPC 8 full level
B21B 1/22 (2006.01); B21B 3/00 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP US)
C22C 9/00 (2013.01 - EP US); C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US)
Citation (search report)
- [XI] WO 2005118896 A1 20051215 - FURUKAWA ELECTRIC CO LTD [JP], et al & DATABASE WPI Week 200605, Derwent World Patents Index; AN 2006-047584
- [XP] US 2007131321 A1 20070614 - KANEKO HIROSHI [JP], et al
- [A] JP 2007016304 A 20070125 - DOWA HOLDINGS CO LTD
- [A] US 2006137773 A1 20060629 - ARUGA YASUHIRO [JP], et al
- See references of WO 2008123455A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2157199 A1 20100224; EP 2157199 A4 20120627; CN 101680056 A 20100324; CN 101680056 B 20130109; JP 2008266787 A 20081106; US 2010170595 A1 20100708; WO 2008123455 A1 20081016
DOCDB simple family (application)
EP 08739314 A 20080328; CN 200880018184 A 20080328; JP 2008056196 W 20080328; JP 2008085013 A 20080327; US 59340208 A 20080328