EP 2158644 B1 20150401 - CONTACT-MAKING SYSTEM
Title (en)
CONTACT-MAKING SYSTEM
Title (de)
KONTAKTIERUNGSSYSTEM
Title (fr)
SYSTÈME DE MISE EN CONTACT
Publication
Application
Priority
- EP 2008057266 W 20080611
- DE 102007029854 A 20070628
Abstract (en)
[origin: WO2009000648A1] A contact-making system is proposed for the spring contacts, which are in the form of spiral springs with a diameter of less than or equal to 0.6 mm and are arranged on a lower face alongside one another, of a microphone having a diameter of less than or equal to 4 mm, which system is cheap and complies with contact-making criteria relating to mechanical robustness, electrical contact-making reliability and simple production with little assembly effort. A contact-making system such as this has mutually electrically isolated flat parts (2; 3) of a contact-making area (1) for making contact with the spring contacts as opposing contacts, wherein the contact-making area (1) is formed by a multilayer structure with different numbers of structure layers depending on the location within the contact-making area (1). The multilayer structure to form the flat parts (2; 3) which form the opposing contacts has a predetermined number of structure layers. Against this background, the contact-making area (1) has a number of structure layers between the flat parts (2; 3) which form the opposing contacts, which number of structure layers is greater by at least one than the predetermined number of structure layers to form the flat parts (2; 3) which form the opposing contacts.
IPC 8 full level
H01R 13/24 (2006.01); H01R 13/41 (2006.01); H04R 1/04 (2006.01); H04R 1/06 (2006.01)
CPC (source: EP)
H01R 13/2421 (2013.01); H01R 13/41 (2013.01); H04R 1/06 (2013.01); H04R 2410/00 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102007029854 B3 20081211; EP 2158644 A1 20100303; EP 2158644 B1 20150401; WO 2009000648 A1 20081231
DOCDB simple family (application)
DE 102007029854 A 20070628; EP 08760822 A 20080611; EP 2008057266 W 20080611