EP 2160514 A1 20100310 - METHOD FOR DISSIPATING HEAT FROM ELECTRONIC COMPONENTS FOR THE OPERATION OF A LIQUID PUMP
Title (en)
METHOD FOR DISSIPATING HEAT FROM ELECTRONIC COMPONENTS FOR THE OPERATION OF A LIQUID PUMP
Title (de)
VERFAHREN ZUR WÄRMEABFUHR VON ELEKTRONISCHEN BAUTEILEN ZUM BETRIEB EINER FLÜSSIGKEITSPUMPE
Title (fr)
PROCÉDÉ POUR DISSIPER DE LA CHALEUR À PARTIR DE COMPOSANTS ÉLECTRONIQUES, AFIN D'ACTIONNER UNE POMPE À LIQUIDES
Publication
Application
Priority
- EP 2008056156 W 20080520
- DE 102007029377 A 20070626
Abstract (en)
[origin: WO2009000601A1] The invention relates to a method in which the electronic components (2) are contacted with a carrier (1) consisting of metallic materials and which consists of a flow pipe (1a) which is integrated in the supply line or in the discharge line for the liquid pump (3) and which, on the outer side thereof, has a plate-shaped element (1b) for contacting the electronic components (2). The heat is dissipated from the electronic components (2) over the plate-shaped element (1b) and the flow pipe (1a) of the carrier (1) into the liquid inflowing medium. A further object of the invention is a device for implementing the method, and the use of the device as a cooling device for cooling electronic components (2) for the operation of a cooling water pump in a motor vehicle.
IPC 8 full level
F04D 29/58 (2006.01)
CPC (source: EP KR)
F01P 3/12 (2013.01 - KR); F04D 13/0686 (2013.01 - EP); F04D 29/58 (2013.01 - KR); F04D 29/5813 (2013.01 - EP)
Citation (search report)
See references of WO 2009000601A1
Designated contracting state (EPC)
DE FR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102007029377 A1 20090108; EP 2160514 A1 20100310; JP 2010531405 A 20100924; KR 20100037036 A 20100408; WO 2009000601 A1 20081231
DOCDB simple family (application)
DE 102007029377 A 20070626; EP 08759772 A 20080520; EP 2008056156 W 20080520; JP 2010513818 A 20080520; KR 20097026164 A 20080520