EP 2161298 B1 20120411 - POLYPROPYLENE RESIN FOAM PARTICLE AND MOLDING THEREOF
Title (en)
POLYPROPYLENE RESIN FOAM PARTICLE AND MOLDING THEREOF
Title (de)
POLYPROPYLENHARZSCHAUMSTOFFTEILCHEN UND FORMKÖRPER DARAUS
Title (fr)
PARTICULE DE MOUSSE DE RÉSINE DE POLYPROPYLÈNE ET SON MOULAGE
Publication
Application
Priority
- JP 2008058830 W 20080514
- JP 2007164724 A 20070622
Abstract (en)
[origin: EP2161298A1] A polypropylene resin foamed bead from which a foamed bead molded article excelling in appearance, heat resistance and mechanical properties can be obtained at the molding temperature lower than that for conventional polypropylene resin foamed beads; and a foamed bead molded article obtained by molding the same. The polypropylene resin foamed bead is characterized by having such a crystal structure that in the first DSC curve obtained when the temperature of the foamed bead sample is raised from ordinary temperature to 200°C at a temperature rising rate of 2°C/min by a differential scanning calorimetry, there appear a main endothermic peak of 100° to 140°C endothermic peak apex temperature exhibiting 70 to 95% endothermic peak calorific value based on the total endothermic peak calorific value and two or more endothermic peaks exhibited on the high temperature side with respect to the main endothermic peak.
IPC 8 full level
C08J 9/18 (2006.01); C08F 10/06 (2006.01); C08J 9/00 (2006.01); C08J 9/12 (2006.01); C08J 9/232 (2006.01)
CPC (source: EP KR US)
C08J 5/00 (2013.01 - KR); C08J 9/0061 (2013.01 - EP US); C08J 9/122 (2013.01 - EP US); C08J 9/18 (2013.01 - EP KR US); C08J 9/232 (2013.01 - EP KR US); C08F 110/06 (2013.01 - EP US); C08F 210/06 (2013.01 - EP US); C08J 2323/12 (2013.01 - EP US); C08J 2423/00 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2161298 A1 20100310; EP 2161298 A4 20110810; EP 2161298 B1 20120411; AT E553149 T1 20120415; CN 101679664 A 20100324; CN 101679664 B 20130206; JP 5498162 B2 20140521; JP WO2009001626 A1 20100826; KR 101455435 B1 20141027; KR 20100033972 A 20100331; TW 200909494 A 20090301; TW I444417 B 20140711; US 2010105787 A1 20100429; US 9023904 B2 20150505; WO 2009001626 A1 20081231
DOCDB simple family (application)
EP 08752701 A 20080514; AT 08752701 T 20080514; CN 200880021457 A 20080514; JP 2008058830 W 20080514; JP 2009520398 A 20080514; KR 20097026645 A 20080514; TW 97120710 A 20080604; US 45191908 A 20080514