Global Patent Index - EP 2162952 A2

EP 2162952 A2 20100317 - ELECTRIC CONNECTION CLAMP OR TERMINAL CLAMP

Title (en)

ELECTRIC CONNECTION CLAMP OR TERMINAL CLAMP

Title (de)

ELEKTRISCHE ANSCHLUSS- ODER VERBINDUNGSKLEMME

Title (fr)

BORNE ÉLECTRIQUE DE RACCORDEMENT ET DE LIAISON

Publication

EP 2162952 A2 20100317 (DE)

Application

EP 08758671 A 20080521

Priority

  • EP 2008004066 W 20080521
  • DE 102007024690 A 20070525

Abstract (en)

[origin: US2010081346A1] An electric connection clamp or terminal clamp for connecting a terminal conductor has a clamp spring and a metal part. The clamp spring has a clamp limb and a contact limb, a recess for introducing the electric conductor being formed in said contact limb. The clamp limb and the contact limb are curved in such a manner that the end of the clamp limb penetrates through the recess. The end of the clamp limb and the contact limb form a spring force clamping connection for the conductor that is to be connected. The ends of the limbs each have a securing section and the securing section of the contact limb extends counter to the direction of introduction of the conductor through the recess.

IPC 8 full level

H01R 4/48 (2006.01)

CPC (source: EP US)

H01R 4/48275 (2023.08 - EP US); H01R 13/04 (2013.01 - EP US)

Citation (search report)

See references of WO 2008145291A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

US 2010081346 A1 20100401; US 7896686 B2 20110301; AT E555519 T1 20120515; CN 101595603 A 20091202; CN 101595603 B 20120905; DE 102007024690 A1 20081204; DE 102007024690 B4 20090604; EP 2162952 A2 20100317; EP 2162952 B1 20120425; JP 2010528411 A 20100819; WO 2008145291 A2 20081204; WO 2008145291 A3 20090402

DOCDB simple family (application)

US 51492508 A 20080521; AT 08758671 T 20080521; CN 200880001203 A 20080521; DE 102007024690 A 20070525; EP 08758671 A 20080521; EP 2008004066 W 20080521; JP 2010508734 A 20080521