EP 2165583 A4 20120516 - AUTOMATED DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS AND MULTILAYER PRINTED CIRCUITS
Title (en)
AUTOMATED DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS AND MULTILAYER PRINTED CIRCUITS
Title (de)
AUTOMATISIERTER DIREKTEMULSIONSPROZESS ZUR HERSTELLUNG VON LEITERPLATTEN UND MEHRSCHICHTIGEN LEITERPLATTEN
Title (fr)
PROCÉDÉ D'ÉMULSION PHOTOSENSIBLE AUTOMATISÉE POUR LA FABRICATION DE CIRCUITS IMPRIMÉS ET DE CIRCUITS IMPRIMÉS MULTICOUCHES
Publication
Application
Priority
- US 2008067405 W 20080618
- US 94473107 P 20070618
Abstract (en)
[origin: WO2008157642A1] A method for making multilayer printed circuits includes a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, b) imaging the coated substrate with a circuit design, c) developing the imaged substrate, d) directly plating the developed image onto the coated substrate, e) coating the plated substrate with a liquid photoimageable cover coat, f) imaging the coated plated substrate with a predesigned circuitry, g) developing the liquid photoimageable cover coat, and repeating steps a) through d). Steps e) through g) are then repeated followed by steps a) through d) until a desired number of layers is achieved for the multilayer circuit. The method may be automated by having a conveyer like system which automatically unrolls and directs a roll of non-metallized substrate through various coating, imaging, developing, and plating stations.
IPC 8 full level
CPC (source: EP)
H05K 3/185 (2013.01); H05K 3/4661 (2013.01); H05K 3/0008 (2013.01); H05K 3/0023 (2013.01); H05K 3/106 (2013.01); H05K 3/4679 (2013.01); H05K 2201/09063 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1545 (2013.01)
Citation (search report)
- [XI] US 2007059646 A1 20070315 - WINSCOM CHRISTOPHER J [GB], et al
- [XI] US 3562005 A 19710209 - DEANGELO MICHAEL ANTHONY, et al
- See references of WO 2008157642A1
Citation (examination)
- US 2006068173 A1 20060330 - KAJIYAMA MASAAKI [JP], et al
- US 6017613 A 20000125 - BAUM THOMAS H [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2008157642 A1 20081224; CN 101785372 A 20100721; CN 101785372 B 20120718; EP 2165583 A1 20100324; EP 2165583 A4 20120516; JP 2010530646 A 20100909
DOCDB simple family (application)
US 2008067405 W 20080618; CN 200880100404 A 20080618; EP 08771412 A 20080618; JP 2010513391 A 20080618