Global Patent Index - EP 2170211 A1

EP 2170211 A1 20100407 - DENTAL IMPLANT

Title (en)

DENTAL IMPLANT

Title (de)

ZAHNIMPLANTAT

Title (fr)

IMPLANT DENTAIRE

Publication

EP 2170211 A1 20100407 (DE)

Application

EP 07763944 A 20070716

Priority

CH 2007000341 W 20070716

Abstract (en)

[origin: WO2009009909A1] The invention relates to a novel dental prosthesis system (1, 2, 3) comprising an implant (10, 11, 12) for osteointegration into a jaw bone and an abutment (20, 21, 22) for receiving a crown (30, 31, 32) that can be bonded thereto. In said system, to collect and subsequently clean off excess adhesive K that escapes when the crown (30, 31, 32) is bonded, a cleaning groove (40, 43, 44) is located in the contact area between the crown (30, 31, 32) and the implant (10, 11, 12). The cleaning groove (40, 43, 44) according to the invention can be integrated into practically all dental prosthesis systems, in which a crown, bridge or another prosthesis is bonded or cemented on an implant and/or abutment. Suitable cleaning instruments for removing the excess adhesive are for example a cleaning wick or a preferably absorbent dental floss, or other cleaning instruments such as interdental brushes. The advantageous action of the cleaning groove is not only useful to the dentist during the bonding process, but also simplifies the process of thorough cleaning of the dental prosthesis in the sensitive transition region between the crown and the implant for the patient.

IPC 8 full level

A61C 8/00 (2006.01)

CPC (source: EP)

A61C 8/0018 (2013.01); A61C 8/006 (2013.01); A61C 8/0068 (2013.01); A61C 8/0069 (2013.01); A61C 8/0075 (2013.01); A61C 8/0077 (2013.01)

Citation (search report)

See references of WO 2009009909A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

WO 2009009909 A1 20090122; EP 2170211 A1 20100407

DOCDB simple family (application)

CH 2007000341 W 20070716; EP 07763944 A 20070716