EP 2170455 B1 20130612 - FLEXIBLE CIRCUIT ELECTRODE ARRAY
Title (en)
FLEXIBLE CIRCUIT ELECTRODE ARRAY
Title (de)
FLEXIBLE ELEKTRODEN-ANORDNUNG
Title (fr)
RESEAU D'ELECTRODES EN CIRCUIT FLEXIBLE
Publication
Application
Priority
- US 2008068640 W 20080627
- US 94669207 P 20070627
- US 1750707 P 20071228
Abstract (en)
[origin: WO2009003182A1] A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes. A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) depositing a second soft polymer layer on the top polymer layer; (f) providing holes in the second soft polymer layer and in the top polymer layer for bond pads and electrodes; and (g) preparing electrodes in the provided holes.
IPC 8 full level
A61N 1/05 (2006.01); H05K 3/28 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01)
CPC (source: EP US)
A61N 1/0543 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); A61N 1/0541 (2013.01 - EP US); H05K 1/036 (2013.01 - EP US); H05K 1/0393 (2013.01 - EP US); H05K 1/118 (2013.01 - EP US); H05K 2201/0133 (2013.01 - EP US); H05K 2201/0195 (2013.01 - EP US); Y10T 156/1002 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2009003182 A1 20081231; AU 2008268154 A1 20081231; AU 2008268154 B2 20130620; EP 2170455 A1 20100407; EP 2170455 B1 20130612; US 2009264972 A1 20091022; US 2012239126 A1 20120920; US 8209023 B2 20120626; US 8489193 B2 20130716
DOCDB simple family (application)
US 2008068640 W 20080627; AU 2008268154 A 20080627; EP 08781123 A 20080627; US 16365808 A 20080627; US 201213460495 A 20120430