Global Patent Index - EP 2171515 A1

EP 2171515 A1 20100407 - MICROMECHANICAL APPARATUS AND METHOD FOR PROJECTION OF ELECTROMAGNETIC RADIATION

Title (en)

MICROMECHANICAL APPARATUS AND METHOD FOR PROJECTION OF ELECTROMAGNETIC RADIATION

Title (de)

MIKROMECHANISCHE VORRICHTUNG UND VERFAHREN ZUM PROJIZIEREN ELEKTROMAGNETISCHER STRAHLUNG

Title (fr)

DISPOSITIF MICROMÉCANIQUE ET PROCÉDÉ DE PROJECTION D'UN RAYONNEMENT ÉLECTROMAGNÉTIQUE

Publication

EP 2171515 A1 20100407 (DE)

Application

EP 08785024 A 20080710

Priority

  • EP 2008006071 W 20080710
  • DE 102007032801 A 20070710

Abstract (en)

[origin: WO2009007139A1] The present invention relates to a micromechanical apparatus having a moving element which comprises a controllable heating apparatus for introduction of a defined amount of heat into the moving element, wherein the apparatus furthermore has a control unit (5) which is designed to control the heating apparatus as a function of an instantaneous temperature and/or of an instantaneous amount of heat that is introduced. By way of example, the apparatus can be designed to project electromagnetic radiation when the moving element is in the form of a beam deflection unit (2) for deflection of radiation, which originates from a radiation source (1), onto a projection surface (3). Finally, the invention also relates to a corresponding method for projection of electromagnetic radiation.

IPC 8 full level

G02B 7/00 (2006.01); G02B 26/08 (2006.01); G02B 26/10 (2006.01)

CPC (source: EP US)

G02B 7/008 (2013.01 - EP US); G02B 26/0833 (2013.01 - EP US); G02B 26/105 (2013.01 - EP US)

Citation (search report)

See references of WO 2009007139A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

DE 102007032801 A1 20090115; EP 2171515 A1 20100407; JP 2010532882 A 20101014; US 2010277782 A1 20101104; WO 2009007139 A1 20090115

DOCDB simple family (application)

DE 102007032801 A 20070710; EP 08785024 A 20080710; EP 2008006071 W 20080710; JP 2010515430 A 20080710; US 66814008 A 20080710