EP 2171698 A2 20100407 - ARRANGEMENT IN A MULTILAYER FLOOR COVERING
Title (en)
ARRANGEMENT IN A MULTILAYER FLOOR COVERING
Title (de)
ANORDNUNG VON HALBLEITERCHIPS IN EINEM MEHRLAGIGEN BODENBELAG
Title (fr)
ARRANGEMENT DANS UN REVÊTEMENT DE SOL MULTICOUCHE
Publication
Application
Priority
- EP 2008058747 W 20080707
- DE 102007031964 A 20070710
Abstract (en)
[origin: WO2009007335A2] The invention relates to an arrangement of chips (10) bonded with sensors (7) in a multilayer floor covering. In order further to improve an arrangement of the type under consideration herein, in a simpler way of technical production, the invention proposes that in a first upper layer (1) circuit paths (4) are formed, separated from each other in a plane, to provide power to a chip (10), that a second middle layer (2) is provided in which the chip (10) is located, and that a third lower layer (3) is provided which likewise is connected electrically to the chip (10), wherein sensors (7) are located in the surface gaps between the chips (10).
IPC 8 full level
G08B 13/10 (2006.01); G01L 1/14 (2006.01); G08B 13/26 (2006.01); H01H 3/14 (2006.01)
CPC (source: EP)
G08B 13/10 (2013.01)
Citation (search report)
See references of WO 2009007335A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102007031964 A1 20090115; EP 2171698 A2 20100407; WO 2009007335 A2 20090115; WO 2009007335 A3 20090409
DOCDB simple family (application)
DE 102007031964 A 20070710; EP 08774821 A 20080707; EP 2008058747 W 20080707