Global Patent Index - EP 2172515 B1

EP 2172515 B1 20120606 - RUBBER COMPOUND AND MOLDED ARTICLE

Title (en)

RUBBER COMPOUND AND MOLDED ARTICLE

Title (de)

KAUTSCHUKMASSE UND FORMKÖRPER

Title (fr)

COMPOSÉ DE CAOUTCHOUC ET ARTICLE MOULÉ

Publication

EP 2172515 B1 20120606 (EN)

Application

EP 08765329 A 20080609

Priority

  • JP 2008060528 W 20080609
  • JP 2007192930 A 20070725

Abstract (en)

[origin: EP2172515A1] A pharmaceutical/medical rubber compound contains the following components: (A) a composition obtainable by crosslinking (a) 100 parts by weight of an isobutylene polymer having terminal alkenyl groups with (d) a hydrosilyl-containing compound in the presence of (b) from 5 to 100 parts by weight of a polyolefin and (c) from 5 to 100 parts by weight of polybutene during melt kneading, and (B) an ultra-high molecular weight polyethylene powder. Compared with conventional thermoplastic elastomers, the pharmaceutical/medical rubber compound and its molded article are free from deformations and have sufficient permanent set resistance even under high temperature conditions, have excellent mechanical properties, low water absorption property, low reactivity and superb gas barrier properties, and can withstand high-temperature sterilization.

IPC 8 full level

C08L 23/00 (2006.01); A61L 31/00 (2006.01); A61L 31/04 (2006.01); C08L 23/04 (2006.01); C08L 23/22 (2006.01); C08L 83/05 (2006.01)

CPC (source: EP US)

A61L 31/049 (2013.01 - EP US); C08L 23/04 (2013.01 - EP US); C08L 23/22 (2013.01 - EP US); C08G 77/12 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2172515 A1 20100407; EP 2172515 A4 20101124; EP 2172515 B1 20120606; DK 2172515 T3 20120716; JP 5551437 B2 20140716; JP WO2009013945 A1 20100930; US 2010197862 A1 20100805; US 8101674 B2 20120124; WO 2009013945 A1 20090129

DOCDB simple family (application)

EP 08765329 A 20080609; DK 08765329 T 20080609; JP 2008060528 W 20080609; JP 2009524420 A 20080609; US 66837708 A 20080609