EP 2172572 B1 20130515 - A STRUCTURAL MATERIAL PART OF A HIGH-SI MG-CONTAINING AL ALLOY AND THE MANUFACTURE METHOD THEREOF
Title (en)
A STRUCTURAL MATERIAL PART OF A HIGH-SI MG-CONTAINING AL ALLOY AND THE MANUFACTURE METHOD THEREOF
Title (de)
BAUSTOFFTEIL AUS SI-REICHER MG-HALTIGER AL-LEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
PIÈCE DE MATÉRIAU DE STRUCTURE EN ALLIAGE D'AL CONTENANT MG ET À FORTE TENEUR EN SI ET PROCÉDÉ DE FABRICATION DE CELLE-CI
Publication
Application
Priority
- CN 2008001246 W 20080630
- CN 200710011919 A 20070629
Abstract (en)
[origin: EP2172572A1] The magnesium-contained high-silicon aluminum alloys for use as structural materials, including profiles, bars, sheets, and forgings, are manufactured by a process including the steps of: casting an alloy ingot by direct chill casting, preheating the ingot to disperse eutectic Si phase particles, and thermal-plastic processing and heat-treating to obtain the product with a final shape and a modified microstructure. The aluminum alloys contain 0.2ˆ¼2.0wt% of Mg and 8ˆ¼18wt% of Si, and have homogeneous and fine microstructure, wherein the aluminum matrix is equiaxed with an average grain size less than 6µm, and the silicon and second phase particles are dispersed with an average size less than 5µm. Without adding any modifiers, they are low-costly produced by incorporating the direct chill casting with thermal-plastic processing and heat treatment, which give rise to good plasticity and relatively high strength.
IPC 8 full level
C22C 21/02 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); C22F 1/043 (2006.01)
CPC (source: EP US)
C22C 21/02 (2013.01 - EP US); C22F 1/043 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2172572 A1 20100407; EP 2172572 A4 20101215; EP 2172572 B1 20130515; CA 2689332 A1 20090108; CN 101333614 A 20081231; CN 101333614 B 20100901; JP 2010531388 A 20100924; KR 20100018048 A 20100216; RU 2009149092 A 20110810; RU 2463371 C2 20121010; US 2010126639 A1 20100527; WO 2009003365 A1 20090108
DOCDB simple family (application)
EP 08772999 A 20080630; CA 2689332 A 20080630; CN 2008001246 W 20080630; CN 200810137603 A 20080630; JP 2010513624 A 20080630; KR 20107000263 A 20080630; RU 2009149092 A 20080630; US 45123208 A 20080630