Global Patent Index - EP 2174221 A2

EP 2174221 A2 20100414 - HIGH INTEGRITY AND HIGH AVAILABILITY COMPUTER PROCESSING MODULE

Title (en)

HIGH INTEGRITY AND HIGH AVAILABILITY COMPUTER PROCESSING MODULE

Title (de)

COMPUTERVERARBEITUNGSMODUL MIT HOHER INTEGRITÄT UND HOHER VERFÜGBARKEIT

Title (fr)

MODULE DE TRAITEMENT D'ORDINATEUR DE HAUTE INTÉGRITÉ ET HAUTE DISPONIBILITÉ

Publication

EP 2174221 A2 20100414 (EN)

Application

EP 08796546 A 20080724

Priority

  • US 2008071023 W 20080724
  • US 93504407 P 20070724
  • US 13871708 A 20080613

Abstract (en)

[origin: WO2009015276A2] A high-integrity, N-lane computer processing module (Module), N being an integer greater than or equal to two. The Module comprises one Hosted Application Element and I/O Element per processing lane, a Time Management unit (TM) configured to determine an equivalent time value for a request made by software running on each of the N processing lanes, irrespective as to when the request is actually received and acted on by each of the N processing lanes, and a Critical Regions Management unit (CRM) configured to enable critical regions within the respective lane to be identified and synchronized across all of the N processing lanes.

IPC 8 full level

G06F 11/16 (2006.01); G06F 1/14 (2006.01)

CPC (source: EP)

G06F 1/14 (2013.01); G06F 11/1687 (2013.01); G06F 11/1683 (2013.01); G06F 2201/845 (2013.01)

Citation (search report)

See references of WO 2009015276A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

WO 2009015276 A2 20090129; WO 2009015276 A3 20090723; BR PI0813077 A2 20170620; BR PI0813077 B1 20200128; BR PI0813077 B8 20200227; CA 2694198 A1 20090129; CA 2694198 C 20170808; CN 101861569 A 20101013; CN 101861569 B 20140319; EP 2174221 A2 20100414; JP 2010534888 A 20101111; JP 5436422 B2 20140305

DOCDB simple family (application)

US 2008071023 W 20080724; BR PI0813077 A 20080724; CA 2694198 A 20080724; CN 200880109465 A 20080724; EP 08796546 A 20080724; JP 2010518384 A 20080724