EP 2174348 A1 20100414 - METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
Title (en)
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
Title (de)
VERFAHREN ZUM HERSTELLEN EINES ELEKTRONISCHEN BAUSTEINS UND ELEKTRONISCHER BAUSTEIN
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE ÉLECTRONIQUE ET MODULE ÉLECTRONIQUE
Publication
Application
Priority
- EP 2008059368 W 20080717
- DE 102007035902 A 20070731
Abstract (en)
[origin: WO2009016041A1] The invention relates to a method for producing an electronic component (100), wherein a plurality of chips (3) disposed in a wafer on a passivated main side having at least one chip contact surface (4, 5) is provided with an insulation layer (7). The insulation layer (7) has openings (12) in the area of the at least one chip contact surface (4, 5) of each chip (3). The chip contact surfaces (4, 5) of each chip (3) are provided with a chip contact surface metallization (8, 9) of a prescribed thickness, and the chips disposed in the wafer (3) are separated therefrom.
IPC 8 full level
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP US)
H01L 21/561 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 23/3185 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 2224/0603 (2013.01 - EP); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/76155 (2013.01 - EP US); H01L 2224/82102 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Citation (search report)
See references of WO 2009016041A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102007035902 A1 20090205; CN 101765912 A 20100630; CN 101765912 B 20130206; EP 2174348 A1 20100414; JP 2010534949 A 20101111; KR 20100059828 A 20100604; US 2010133577 A1 20100603; WO 2009016041 A1 20090205
DOCDB simple family (application)
DE 102007035902 A 20070731; CN 200880101035 A 20080717; EP 08786207 A 20080717; EP 2008059368 W 20080717; JP 2010518604 A 20080717; KR 20107004606 A 20080717; US 45295508 A 20080717