EP 2179443 A1 20100428 - UNIT AND PRODUCTION OF A UNIT
Title (en)
UNIT AND PRODUCTION OF A UNIT
Title (de)
BAUGRUPPE SOWIE HERSTELLUNG EINER BAUGRUPPE
Title (fr)
MODULE ET FABRICATION D'UN TEL MODULE
Publication
Application
Priority
- EP 2008058705 W 20080704
- DE 102007037538 A 20070809
Abstract (en)
[origin: WO2009019091A1] The invention relates to a unit (1) having a substrate (5) and at least one component (3) mounted thereon by sintering using a sintering agent (8), particularly sintering paste. According to the invention, the sintering agent (8) is disposed in a depression (7) of the substrate (5) at least partially receiving the component (3). The invention further relates to a method for producing a unit having a substrate and at least one component mounted thereon by sintering using a sintering agent, particularly sintering paste. According to the invention, the sintering agent is placed in a depression of the substrate at least partially receiving the component.
IPC 8 full level
H01L 23/13 (2006.01); H01L 21/60 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP US)
B23K 35/025 (2013.01 - US); H01L 23/13 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 23/3737 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/31 (2013.01 - EP US); H01L 24/75 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H05K 3/321 (2013.01 - EP US); H01L 2224/26175 (2013.01 - EP US); H01L 2224/29022 (2013.01 - EP); H01L 2224/29101 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP); H01L 2224/32237 (2013.01 - EP); H01L 2224/75315 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/83801 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/15156 (2013.01 - EP US); H01L 2924/15157 (2013.01 - EP); H01L 2924/15747 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 2201/09745 (2013.01 - EP US); H05K 2201/10166 (2013.01 - EP US); H05K 2203/1131 (2013.01 - EP US); Y10T 428/24612 (2015.01 - EP US)
Citation (search report)
See references of WO 2009019091A1
Citation (examination)
- JP 2005136375 A 20050526 - HITACHI LTD
- JP 2005101353 A 20050414 - TOSHIBA CORP
- JP 2006352080 A 20061228 - FUJI ELECTRIC HOLDINGS
- JP H0945814 A 19970214 - NEC CORP
- JP H0547810 A 19930226 - FUJITSU MIYAGI ELECTRON KK
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102007037538 A1 20090212; CN 101779285 A 20100714; CN 101779285 B 20130116; EP 2179443 A1 20100428; JP 2010536168 A 20101125; US 2010252312 A1 20101007; US 2014001244 A1 20140102; US 8552306 B2 20131008; US 9233436 B2 20160112; WO 2009019091 A1 20090212
DOCDB simple family (application)
DE 102007037538 A 20070809; CN 200880102663 A 20080704; EP 08774783 A 20080704; EP 2008058705 W 20080704; JP 2010519400 A 20080704; US 201314017399 A 20130904; US 67115308 A 20080704