EP 2180071 A1 20100428 - COPPER ALLOY MATERIAL
Title (en)
COPPER ALLOY MATERIAL
Title (de)
KUPFERLEGIERUNGSWERKSTOFF
Title (fr)
MATÉRIAU D'ALLIAGE DE CUIVRE
Publication
Application
Priority
JP 2007064813 W 20070727
Abstract (en)
A copper alloy material consisting of, by mass% Ti: 0.01-2.5%, Cr: 0.01-0.5%, Fe: 0.01% or more and less than 1%, and the balance Cu and impurities, in which the relationship between the total number N and the diameter X (m) of precipitates and inclusions having a diameter of 1 m or more satisfies the following formula (1); the relationship between tensile strength TS (MPa) and electrical conductivity, IACS (%) satisfies the following formula (2); when the copper alloy material is sheet possessing a tensile strength of 600 MPa or less, the bending workability in the bad way B 90 of the copper alloy material satisfies the following formula (3): when the copper alloy material is sheet possessing a tensile strength of 600 MPa or more, the relationship between TS (MPa) and B 90 satisfies the following formula (4); and when the copper alloy material is other than a sheet, the relationship between elongation El (%) and TS (MPa) satisfies the following formula (5). The copper alloy may include other elements such as Ag and possesses excellent strength, electrical conductivity and workability without containing any environmentally harmful elements. logN ‰¤ 0.4742 + 17.629 × exp - 0.1133 × X TS ‰¥ 648.06 + 985.48 × exp - 0.0513 × IACS B 90 ‰¤ 2.0 B 90 ‰¤ 25.093 - 54.82 × exp - TS + 583.61 / 1254 2 + 1.25 × t El ‰¥ 24.138 - 24.6076 × exp - TS - 1816.36 / 2213.52 2
IPC 8 full level
C22C 9/00 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP US)
Citation (search report)
See references of WO 2009016706A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
EP 2180071 A1 20100428; CN 101821416 A 20100901; JP 4134279 B1 20080820; JP WO2009016706 A1 20101007; US 2010189593 A1 20100729; WO 2009016706 A1 20090205
DOCDB simple family (application)
EP 07791507 A 20070727; CN 200780100048 A 20070727; JP 2007064813 W 20070727; JP 2008513833 A 20070727; US 69369610 A 20100126