EP 2181164 A2 20100505 - AN UNDERCOATING LAYER FORMULATION FOR NON-PLATABLE GRADE SUBSTRATE FOR ELECTROLESS METAL PLATING
Title (en)
AN UNDERCOATING LAYER FORMULATION FOR NON-PLATABLE GRADE SUBSTRATE FOR ELECTROLESS METAL PLATING
Title (de)
UNTERSCHICHTFORMULIERUNG FÜR NICHTPLATTIERBARES SUBSTRAT FÜR STROMLOSE METALLISIERUNG
Title (fr)
FORMULATION DE COUCHE DE SOUS-REVÊTEMENT POUR SUBSTRAT DE QUALITÉ NON GALVANISABLE POUR REVÊTEMENT MÉTALLIQUE ANÉLECTROLYTIQUE
Publication
Application
Priority
- MY 2008000029 W 20080408
- MY PI20070548 A 20070410
Abstract (en)
[origin: WO2008123767A2] Described herein is a coating formulation for non-platable grade substrate prior to undergoing an electroless metal plating process. Said coating formulation comprises of a mixture of multifunctional based monomer and diphenylmetane- 4, 4-diisocyanate (MDI), said multifunctional based monomer has allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof but does not include multifunctional monomer having hydroxyl group. According to the present invention, the ratio of said multifunctional based monomer is less than or equal (<) to diphenylmetane-4, 4-diisocyanate (MDI). Said coating formulation is mixed in a vacuum chamber for about 30 minutes before being applied to the surface of a non-platable grade substrate.
IPC 8 full level
C09D 125/00 (2006.01); C08L 75/08 (2006.01); C23C 18/18 (2006.01)
CPC (source: EP)
C08G 18/04 (2013.01); C09D 4/00 (2013.01); C09D 175/04 (2013.01); C23C 18/1601 (2013.01); C23C 18/1893 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2008123767 A2 20081016; WO 2008123767 A3 20081211; CN 101743286 A 20100616; EP 2181164 A2 20100505; EP 2181164 A4 20110126
DOCDB simple family (application)
MY 2008000029 W 20080408; CN 200880019459 A 20080408; EP 08741606 A 20080408