Global Patent Index - EP 2181461 A1

EP 2181461 A1 20100505 - MODULE CONSTRUCTION AND CONNECTION TECHNOLOGY BY MEANS OF METAL SCRAP WEB OR BENT STAMPING PARTS BENT FROM A PLANE

Title (en)

MODULE CONSTRUCTION AND CONNECTION TECHNOLOGY BY MEANS OF METAL SCRAP WEB OR BENT STAMPING PARTS BENT FROM A PLANE

Title (de)

AUFBAU- UND VERBINDUNGSTECHNIK VON MODULEN MITTELS AUS EINER EBENE HERAUS GEBOGENEN METALLISCHEN STANZGITTER ODER STANZBIEGETEILEN

Title (fr)

TECHNIQUE DE CONSTRUCTION ET DE RACCORD DE MODULES AU MOYEN D'UN PATRON DE DECOUPAGE METALLIQUE PLIE HORS D'UN PLAN OU DE PIECES DECOUPEES ET PLIEES HORS D'UN PLAN

Publication

EP 2181461 A1 20100505 (DE)

Application

EP 08786502 A 20080728

Priority

  • EP 2008059861 W 20080728
  • DE 102007039916 A 20070823

Abstract (en)

[origin: WO2009024432A1] The present invention relates to modules (1) having at least one unhoused electronic component (2), particularly an unhoused semiconductor component or unhoused semiconductor power component, each having at least one connecting surface (3) disposed on a top side and/or bottom side for electrically contacting and/or mounting, the at least one component (2) being positioned between respective substrates (5) such that the contact surfaces (3) each electrically contact and/or are attached to opposing electrical conductors (7) and/or mounting surfaces on the substrates (5). The aim of the invention is to provide an inexpensive electrical contact, particularly having a high integration density, low-inductance behavior, high current capacity, good cooling, and high reliability under electrical and thermal cyclic loading. The invention is characterized in that at least one metal scrap web or bent stamping part (9) is bent out of a plane of the substrates (5) and can be combined with metal scrap webs or bent stamping parts (11) extending in a plane. The module (1) is particularly suitable for high-voltage applications greater than 1000 V, and corresponding electronic components (2).

IPC 8 full level

H01L 23/495 (2006.01)

CPC (source: EP)

H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01L 23/49537 (2013.01); H01L 23/49551 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 23/3107 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01)

Citation (search report)

See references of WO 2009024432A1

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

DE 102007039916 A1 20090226; CN 101785104 A 20100721; EP 2181461 A1 20100505; EP 2341533 A2 20110706; EP 2341533 A3 20130116; WO 2009024432 A1 20090226

DOCDB simple family (application)

DE 102007039916 A 20070823; CN 200880104041 A 20080728; EP 08786502 A 20080728; EP 11002935 A 20080728; EP 2008059861 W 20080728