Global Patent Index - EP 2182340 A1

EP 2182340 A1 20100505 - Pressure Sensor and Guide Wire Assembly

Title (en)

Pressure Sensor and Guide Wire Assembly

Title (de)

Drucksensor und Führungsdrahtanordnung

Title (fr)

Capteur de pression et ensemble de fil guide

Publication

EP 2182340 A1 20100505 (EN)

Application

EP 08167971 A 20081030

Priority

EP 08167971 A 20081030

Abstract (en)

A pressure sensor chip is described. The pressure sensor chip include a substrate, a polycrystalline silicon layer, at least one silicon layer, and a diaphragm movement element. The polycrystalline silicon layer is formed on the substrate and has a cavity recess formed therein. The at least one silicon layer is formed on the polycrystalline silicon layer and covers the cavity recess thereby forming a reference chamber with a diaphragm. The diaphragm movement element is configured to sense movement of the diaphragm. An assembly incorporating the pressure sensor chip and a method of forming the pressure sensor chip are also described.

IPC 8 full level

G01L 9/00 (2006.01); G01L 19/00 (2006.01)

CPC (source: EP)

A61B 5/0215 (2013.01); A61B 5/6851 (2013.01); G01L 9/0055 (2013.01); G01L 19/0092 (2013.01)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 2182340 A1 20100505

DOCDB simple family (application)

EP 08167971 A 20081030