EP 2183986 A1 20100512 - Low application temperature hot melt adhesive for cigarette preparation
Title (en)
Low application temperature hot melt adhesive for cigarette preparation
Title (de)
Heißschmelzkleber mit niedriger Anwendungstemperatur zur Zigarettenherstellung
Title (fr)
Adhésif thermofusible à faible température d'application pour la préparation de cigarettes
Publication
Application
Priority
- EP 10154218 A 20000623
- EP 00946847 A 20000623
- US 0017300 W 20000623
Abstract (en)
A cigarette filter, process to manufacture, wherein a low application temperature ethylene vinyl acetate copolymer based hot melt adhesive is applied to porous and/or nonporous plugwrap paper. As used herein, low application temperatures are temperature between 200 °F and 300 °F (93 °C and 149 °C), preferably, 240 °F to 275 °F (115 °C to 135 °C).
IPC 8 full level
CPC (source: EP)
Citation (applicant)
- US 4326543 A 19820427 - MARTIN JULIAN R, et al
- US 4173504 A 19791106 - KUNIMUNE KOHICHI [JP], et al
Citation (search report)
- [I] US 4326543 A 19820427 - MARTIN JULIAN R, et al
- [I] US 4173504 A 19791106 - KUNIMUNE KOHICHI [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0200045 A1 20020103; AU 6054300 A 20020108; EP 1408781 A1 20040421; EP 1408781 B1 20131016; EP 1408781 B8 20131204; EP 2183986 A1 20100512; EP 2183986 B1 20130724; ES 2431292 T3 20131125; ES 2439890 T3 20140127
DOCDB simple family (application)
US 0017300 W 20000623; AU 6054300 A 20000623; EP 00946847 A 20000623; EP 10154218 A 20000623; ES 00946847 T 20000623; ES 10154218 T 20000623