Global Patent Index - EP 2184117 B1

EP 2184117 B1 20110105 - Leveling method for burying evaporating section of heat pipe into thermally conductive seat

Title (en)

Leveling method for burying evaporating section of heat pipe into thermally conductive seat

Title (de)

Ausgleichsverfahren für den verborgenen Verdunstungsteil einer Wärmepumpe in einen wärmeleitfähigen Sitz

Title (fr)

Procédé de nivellement pour enterrer la section d'évaporation de caloduc dans un siège conduisant la chaleur

Publication

EP 2184117 B1 20110105 (EN)

Application

EP 08019532 A 20081107

Priority

EP 08019532 A 20081107

Abstract (en)

[origin: EP2184117A1] A leveling method for burying an evaporating section (10) of a heat pipe (1) into a thermally conductive seat (2) is provided for an assembly of heat pipe (1) and heat-conducting seat (2) by simultaneously making the evaporating section (10) of heat pipe (1) partially formed into a flat surface (100) when the evaporating section (10) of heat pipe (1) is being buried into the thermally conductive seat (2). Furthermore, in cooperation with a stamping machine (4), the leveling method is to make a multiple steps of press-fitting process to an evaporating section (10) of heat pipe (1) under a condition that there is no need to change the stamping die.

IPC 8 full level

B21D 39/00 (2006.01); B21D 53/02 (2006.01); F28D 15/02 (2006.01)

CPC (source: EP)

B21D 39/00 (2013.01); B21D 53/02 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28F 2275/12 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2184117 A1 20100512; EP 2184117 B1 20110105; AT E494085 T1 20110115; DE 602008004360 D1 20110217

DOCDB simple family (application)

EP 08019532 A 20081107; AT 08019532 T 20081107; DE 602008004360 T 20081107