EP 2193010 A4 20131016 - POLISHING PAD
Title (en)
POLISHING PAD
Title (de)
POLIERKISSEN
Title (fr)
TAMPON DE POLISSAGE
Publication
Application
Priority
- US 2008009687 W 20080813
- US 95629307 P 20070816
Abstract (en)
[origin: WO2009025748A1] The invention provides a polishing pad comprising a polishing layer having a polishing surface comprising plurality of grooves disposed into the polishing layer a measurable depth from the polishing surface, and a barrier region free of grooves, and a transparent window disposed in and surrounded by the barrier region.
IPC 8 full level
B24B 37/26 (2012.01); B24B 37/20 (2012.01)
CPC (source: EP US)
B24B 37/205 (2013.01 - EP US); B24B 37/26 (2013.01 - EP US)
Citation (search report)
- [XY] WO 2004009291 A1 20040129 - APPLIED MATERIALS INC [US]
- [XY] JP 2007118106 A 20070517 - TOYO TIRE & RUBBER CO
- [Y] US 2005060943 A1 20050324 - TURNER KYLE A [US], et al
- See references of WO 2009025748A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2009025748 A1 20090226; CN 101778701 A 20100714; CN 101778701 B 20120627; EP 2193010 A1 20100609; EP 2193010 A4 20131016; EP 2193010 B1 20200108; IL 203461 A 20141130; JP 2010536583 A 20101202; JP 5307815 B2 20131002; KR 101203789 B1 20121121; KR 20100068255 A 20100622; MY 154071 A 20150430; SG 183738 A1 20120927; TW 200922748 A 20090601; TW I411495 B 20131011; US 2011183579 A1 20110728
DOCDB simple family (application)
US 2008009687 W 20080813; CN 200880102761 A 20080813; EP 08795288 A 20080813; IL 20346110 A 20100124; JP 2010521026 A 20080813; KR 20107005681 A 20080813; MY PI20100193 A 20080813; SG 2012060802 A 20080813; TW 97127831 A 20080722; US 67305708 A 20080813