EP 2197051 B1 20161214 - Light emitting device and method for manufacturing same
Title (en)
Light emitting device and method for manufacturing same
Title (de)
Lichtemittierende Vorrichtung und Verfahren zu ihrer Herstellung
Title (fr)
Dispositif électroluminescent et son procédé de fabrication
Publication
Application
Priority
JP 2008316752 A 20081212
Abstract (en)
[origin: EP2197051A2] A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01)
CPC (source: EP US)
H01L 24/11 (2013.01 - EP US); H01L 24/12 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 25/0753 (2013.01 - EP US); H01L 33/34 (2013.01 - EP US); H01L 33/44 (2013.01 - EP US); H01L 33/486 (2013.01 - EP US); H01L 33/50 (2013.01 - US); H01L 33/62 (2013.01 - EP US); H01L 24/02 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 33/0093 (2020.05 - EP US); H01L 33/38 (2013.01 - EP US); H01L 33/58 (2013.01 - EP US); H01L 2224/02375 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/05012 (2013.01 - EP US); H01L 2224/05552 (2013.01 - EP US); H01L 2224/05555 (2013.01 - EP US); H01L 2224/05571 (2013.01 - EP US); H01L 2224/06132 (2013.01 - EP US); H01L 2224/06152 (2013.01 - EP US); H01L 2224/13023 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/10329 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2933/0016 (2013.01 - US); H01L 2933/0033 (2013.01 - US); H01L 2933/0041 (2013.01 - US); H01L 2933/0066 (2013.01 - US)
Citation (examination)
- US 2007262338 A1 20071115 - HIGASHI KAZUSHI [JP], et al
- US 2009179207 A1 20090716 - CHITNIS ASHAY [US], et al
- JP 2008277409 A 20081113 - MATSUSHITA ELECTRIC IND CO LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2197051 A2 20100616; EP 2197051 A3 20110622; EP 2197051 B1 20161214; JP 2010141176 A 20100624; JP 4724222 B2 20110713; TW 201031033 A 20100816; TW 201421740 A 20140601; TW I501426 B 20150921; TW I505507 B 20151021; US 2010148198 A1 20100617; US 2012097972 A1 20120426; US 2016027982 A1 20160128; US 8110421 B2 20120207; US 9184357 B2 20151110; US 9478722 B2 20161025
DOCDB simple family (application)
EP 09166830 A 20090730; JP 2008316752 A 20081212; TW 102148487 A 20091210; TW 98142319 A 20091210; US 201113310384 A 20111202; US 201514875192 A 20151005; US 50575909 A 20090720