EP 2205778 A1 20100714 - METHOD OF OBTAINING A YELLOW GOLD ALLOY COATING BY ELECTROPLATING WITHOUT THE USE OF TOXIC METALS OR METALLOIDS
Title (en)
METHOD OF OBTAINING A YELLOW GOLD ALLOY COATING BY ELECTROPLATING WITHOUT THE USE OF TOXIC METALS OR METALLOIDS
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES ÜBERZUGS AUS GELBER GOLDLEGIERUNG DURCH GALVANISIEREN OHNE VERWENDUNG VON TOXISCHEN METALLEN ODER METALLOIDEN
Title (fr)
PROCÉDÉ D'OBTENTION D'UN DÉPÔT D'ALLIAGE D'OR JAUNE PAR GALVANOPLASTIE SANS UTILISATION DE MÉTAUX OU MÉTALLOÏDES TOXIQUES
Publication
Application
Priority
- EP 2008062042 W 20080911
- CH 14942007 A 20070921
Abstract (en)
[origin: WO2009037180A1] The invention relates to an electroplated coating in the form of a gold alloy, which has a thickness of between 1 and 800 microns and contains copper. According to the invention, the coating includes indium as third main component. The invention relates to the field of electroplating processes.
IPC 8 full level
C25D 3/62 (2006.01)
CPC (source: EP US)
Citation (search report)
See references of WO 2009037180A1
Citation (third parties)
Third party :
JP 2001198693 A 20010724 - ISHIFUKU METAL IND
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2009037180 A1 20090326; AT E499461 T1 20110315; CH 710184 B1 20160331; CN 101815814 A 20100825; CN 101815814 B 20120516; DE 602008005184 D1 20110407; EP 2205778 A1 20100714; EP 2205778 B1 20110223; HK 1147782 A1 20110819; IN 2464CHN2014 A 20150807; JP 2010539335 A 20101216; JP 2014194087 A 20141009; JP 5563462 B2 20140730; JP 5887381 B2 20160316; KR 101280675 B1 20130701; KR 20100075935 A 20100705; TW 200930844 A 20090716; TW 201428143 A 20140716; TW I441959 B 20140621; TW I507571 B 20151111; US 10233555 B2 20190319; US 10619260 B2 20200414; US 2010206739 A1 20100819; US 2014299481 A1 20141009; US 2019153608 A1 20190523; US 9683303 B2 20170620
DOCDB simple family (application)
EP 2008062042 W 20080911; AT 08804009 T 20080911; CH 14942007 A 20070921; CN 200880107881 A 20080911; DE 602008005184 T 20080911; EP 08804009 A 20080911; HK 11101836 A 20110224; IN 2464CHN2014 A 20140401; JP 2010525308 A 20080911; JP 2014121169 A 20140612; KR 20107008598 A 20080911; TW 103113847 A 20080917; TW 97135667 A 20080917; US 201414244071 A 20140403; US 201916259444 A 20190128; US 67898408 A 20080911