EP 2217887 A1 20100818 - SENSOR MODULE AND METHOD FOR PRODUCING THE SENSOR MODULE
Title (en)
SENSOR MODULE AND METHOD FOR PRODUCING THE SENSOR MODULE
Title (de)
SENSORMODUL UND VERFAHREN ZUR HERSTELLUNG DES SENSORMODULS
Title (fr)
MODULE DÉTECTEUR ET SON PROCÉDÉ DE PRODUCTION
Publication
Application
Priority
- EP 2008066100 W 20081125
- DE 102007057904 A 20071129
Abstract (en)
[origin: WO2009068508A1] The invention relates to a sensor module (1) having a sensor chip (2) mounted on a conductor mesh (4). A plastic sleeve (11) of the sensor module (1) extends solely over an edge area of the sensor chip (2). The mechanical load of the sensor chip (2) due to the plastic sleeve (11) is kept low.
IPC 8 full level
G01D 11/24 (2006.01)
CPC (source: EP)
G01D 11/245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01)
Citation (search report)
See references of WO 2009068508A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102007057904 A1 20090604; EP 2217887 A1 20100818; WO 2009068508 A1 20090604
DOCDB simple family (application)
DE 102007057904 A 20071129; EP 08853353 A 20081125; EP 2008066100 W 20081125