EP 2218098 A2 20100818 - PRODUCTION OF FREE-STANDING SOLID STATE LAYERS BY THERMAL PROCESSING OF SUBSTRATES WITH A POLYMER
Title (en)
PRODUCTION OF FREE-STANDING SOLID STATE LAYERS BY THERMAL PROCESSING OF SUBSTRATES WITH A POLYMER
Title (de)
HERSTELLUNG VON FREISTEHENDEN FESTKÖRPERSCHICHTEN DURCH THERMISCHE VERARBEITUNG VON SUBSTRATEN MIT EINEM POLYMER
Title (fr)
FABRICATION DE COUCHES AUTONOMES À SEMI-CONDUCTEURS PAR TRAITEMENT THERMIQUE DE SUBSTRATS PAR UN POLYMÈRE
Publication
Application
Priority
- US 2008012140 W 20081024
- CH 17122007 A 20071102
- CH 18512007 A 20071130
Abstract (en)
[origin: WO2009061353A2] In a method for producing a free-standing solid state layer, a solid state material is provided having at least one surface available for layer formation thereon and a layer of polymer is formed on the available surface. The solid state material and polymer layer are then exposed to a change in local temperature from a first temperature that is about room temperature to a second temperature to cause the solid state material to fracture along a plane at a depth in the material, to produce at least one free-standing solid state layer from the solid state material.
IPC 8 full level
H01L 21/762 (2006.01)
CPC (source: EP US)
H01L 21/76251 (2013.01 - EP US); H01L 31/1804 (2013.01 - EP US); H01L 31/1896 (2013.01 - EP US); Y02E 10/547 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 2009061353A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2009061353 A2 20090514; WO 2009061353 A3 20090625; AU 2008325223 A1 20090514; EP 2218098 A2 20100818; EP 2218098 B1 20180815; JP 2011505684 A 20110224; JP 5520226 B2 20140611; KR 101546112 B1 20150820; KR 20100096129 A 20100901; MX 2010004896 A 20100729; RU 2010122313 A 20111210; RU 2472247 C2 20130110; TW 200933703 A 20090801; TW I426546 B 20140211; US 2010289189 A1 20101118; US 8440129 B2 20130514
DOCDB simple family (application)
US 2008012140 W 20081024; AU 2008325223 A 20081024; EP 08847768 A 20081024; JP 2010533064 A 20081024; KR 20107012250 A 20081024; MX 2010004896 A 20081024; RU 2010122313 A 20081024; TW 97142199 A 20081031; US 74037308 A 20081024