EP 2218804 A1 20100818 - COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE COPPER-ZINC ALLOY ELECTROPLATING BATH
Title (en)
COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE COPPER-ZINC ALLOY ELECTROPLATING BATH
Title (de)
GALVANISIERUNGSBAD AUS KUPFER-ZINK-LEGIERUNG UND PLATTIERUNGSVERFAHREN MIT DEM GALVANISIERUNGSBAD AUS KUPFER-ZINK-LEGIERUNG
Title (fr)
BAIN D'ÉLECTRODÉPOSITION D'ALLIAGE CUIVRE-ZINC ET PROCÉDÉ DE DÉPOSITION UTILISANT LE BAIN D'ÉLECTRODÉPOSITION D'ALLIAGE CUIVRE-ZINC
Publication
Application
Priority
- JP 2008071470 W 20081126
- JP 2007304377 A 20071126
- JP 2007304376 A 20071126
Abstract (en)
A cyanide-free copper-zinc alloy electroplating bath is provided which can form a uniform and glossy alloy layer having the desired composition even at a higher current density than that for a conventional electroplating bath, and which is excellent in productivity. The copper-zinc alloy electroplating bath comprises at least one selected from a copper salt, zinc salt, alkali metal pyrophosphate, and amino acid or a salt thereof, and has a pH of 8.5 to 14. The pH is preferably 10.5 to 11.8; and the concentration of the amino acid or a salt thereof is preferably 0.08 mol/L to 0.22 mol/L, more preferably 0.1 mol/L to 0.13 mol/L. As the amino acid or a salt thereof, histidine or a salt thereof may be preferably used.
IPC 8 full level
C25D 3/58 (2006.01)
CPC (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 2218804 A1 20100818; EP 2218804 A4 20110824; CN 101874128 A 20101027; CN 101874128 B 20120704; US 2010243466 A1 20100930; WO 2009069669 A1 20090604
DOCDB simple family (application)
EP 08854020 A 20081126; CN 200880117760 A 20081126; JP 2008071470 W 20081126; US 74464108 A 20081126