Global Patent Index - EP 2221391 A4

EP 2221391 A4 20120627 - COPPER ALLOY SHEET MATERIAL

Title (en)

COPPER ALLOY SHEET MATERIAL

Title (de)

KUPFERLEGIERUNGSBLECHMATERIAL

Title (fr)

MATÉRIAU EN FEUILLE EN ALLIAGE DE CUIVRE

Publication

EP 2221391 A4 20120627 (EN)

Application

EP 08847798 A 20081105

Priority

  • JP 2008070139 W 20081105
  • JP 2007287066 A 20071105

Abstract (en)

[origin: EP2221391A1] A copper alloy sheet material which has a tensile strength of 730-820 MPa and contains at least nickel (Ni) and silicon (Si) , with the remainder being copper (Cu) and inevitable impurities. When the sheet material has a shape capable of 180° tight bending and the width and thickness of this sheet material are expressed by W (unit: mm) and T (unit: mm) respectively, then the product of W and T is 0.16 or less. Preferably, the sheet material is constituted of an alloy containing nickel at 1.8-3.3 mass%, silicon at 0.4 mass%, and chromium (Cr) at 0.01-0.5 mass%, with the remainder being copper and inevitable impurities. The sheet material may further contain one or more of: at least one member selected among tin (Sn), magnesium (Mg), silver (Ag), manganese (Mn), titanium (Ti), iron (Fe), and phosphorus (P) in a total amount of 0.01-1 mass%; zinc (Zn) at 0.01-10 mass%, cobalt (Co) at and 0.01-1.5 mass%.

IPC 8 full level

C22C 9/06 (2006.01); B21B 3/00 (2006.01); C22C 9/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP US)

C22C 9/04 (2013.01 - EP US); C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); B21B 3/00 (2013.01 - EP US); B21B 2003/005 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2221391 A1 20100825; EP 2221391 A4 20120627; EP 2221391 B1 20140430; CN 101849027 A 20100929; CN 101849027 B 20130515; JP 4785092 B2 20111005; JP WO2009060873 A1 20110324; KR 101515668 B1 20150427; KR 20100095431 A 20100830; US 2011038753 A1 20110217; WO 2009060873 A1 20090514

DOCDB simple family (application)

EP 08847798 A 20081105; CN 200880114702 A 20081105; JP 2008070139 W 20081105; JP 2009540067 A 20081105; KR 20107012166 A 20081105; US 74130908 A 20081105