Global Patent Index - EP 2229564 A4

EP 2229564 A4 20140115 - MOUNTING OF PRESSURE RELIEF DEVICES IN A HIGH PRESSURE REFRIGERATION SYSTEM

Title (en)

MOUNTING OF PRESSURE RELIEF DEVICES IN A HIGH PRESSURE REFRIGERATION SYSTEM

Title (de)

BEFESTIGUNG VON DRUCKENTLASTUNGSVORRICHTUNGEN IN EINER HOCHDRUCKKÄLTEANLAGE

Title (fr)

MONTAGE DE DISPOSITIFS LIMITEURS DE PRESSION DANS UN SYSTÈME DE RÉFRIGÉRATION HAUTE PRESSION

Publication

EP 2229564 A4 20140115 (EN)

Application

EP 08727834 A 20080117

Priority

US 2008051313 W 20080117

Abstract (en)

[origin: WO2009091398A1] A plurality of pressure relief devices are disposed within a refrigeration circuit, and each of the pressure relief devices is located within a compartment that fluidly communicates with the ambient air. Each of the pressure relief devices is oriented so that the release of high pressure vapor therefrom is directed to a rear wall of the compartment. Further, a four sided cover is disposed over each of the pressure relief devices so as to partially contain any released vapor and allow it to be discharged in one direction only.

IPC 8 full level

F25B 1/10 (2006.01); F25B 9/00 (2006.01); F25B 41/04 (2006.01); F25B 45/00 (2006.01); F25B 49/02 (2006.01)

CPC (source: EP US)

F25B 1/10 (2013.01 - EP US); F25B 41/20 (2021.01 - EP US); F25B 49/02 (2013.01 - EP US); F25B 9/008 (2013.01 - EP US); F25B 2309/06 (2013.01 - EP US); F25B 2400/16 (2013.01 - EP US); F25B 2600/2525 (2013.01 - EP US)

Citation (search report)

Citation (examination)

US 5794915 A 19980818 - SHIMIZU HIDEHIKO [JP], et al

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2009091398 A1 20090723; CN 101910758 A 20101208; CN 101910758 B 20121003; EP 2229564 A1 20100922; EP 2229564 A4 20140115; HK 1151340 A1 20120127; JP 2011510255 A 20110331; US 2010269523 A1 20101028

DOCDB simple family (application)

US 2008051313 W 20080117; CN 200880124979 A 20080117; EP 08727834 A 20080117; HK 11105296 A 20110527; JP 2010543097 A 20080117; US 74576308 A 20080117